A3P600-2FGG256

The A3P600-2FGG256 is a ProASIC3 field programmable gate array (FPGA) offered in a 256-ball LBGA package. It provides a fixed set of on-chip resources including 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 177 user I/Os for mid-density programmable logic designs.

With a supply voltage range of 1.425 V to 1.575 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets designs that require a balance of integration, I/O count and compact packaging for surface-mount applications.

Key Features

• Core Logic  13,824 logic elements (cells) suitable for mid-density programmable logic implementations.
• Embedded Memory  110,592 bits of on-chip RAM (approximately 0.11 Mbits) for local data storage and buffering.
• I/O Capacity  177 user I/Os to support interfacing with multiple peripherals, buses and external devices.
• Gate Count  Approximately 600,000 gates to indicate overall logic complexity and integration capability.
• Power  Single supply operation within 1.425 V to 1.575 V for core power planning and board-level supply design.
• Package & Mounting  256-LBGA (supplier package: 256-FPBGA, 17 × 17 mm) in a surface-mount form factor for compact PCB layouts.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C for standard embedded and electronic applications.
• Environmental Compliance  RoHS compliant to meet lead-free assembly and regulatory requirements.

Typical Applications

• Embedded Logic and Glue  Use as a programmable glue logic device where up to 13,824 logic elements and 177 I/Os simplify system integration.
• Interface Concentration  Consolidate multiple peripheral interfaces and custom I/O routing using the device’s available I/O and on-chip RAM.
• Control and Signal Processing  Implement control paths and small to mid-scale signal processing functions leveraging available logic elements and embedded memory.

Unique Advantages

• Mid-density integration: 13,824 logic elements and ~600,000 gates allow meaningful functionality consolidation on a single device.
• Generous I/O count: 177 user I/Os enable flexible board-level interfacing without extra interface chips.
• Compact package: 256-LBGA (17 × 17 mm) surface-mount package supports high-density PCB layouts and reduced BOM footprint.
• Predictable power planning: Defined supply range (1.425 V–1.575 V) simplifies core power design and regulator selection.
• Commercial-grade suitability: Rated for 0 °C to 85 °C, matching typical industrial and consumer embedded applications.
• RoHS compliant: Meets lead-free assembly requirements for modern manufacturing processes.

Why Choose A3P600-2FGG256?

The A3P600-2FGG256 positions itself as a compact, mid-density FPGA option that brings together a substantial logic element count, on-chip memory and a high I/O count in a 256-LBGA surface-mount package. It is suited to designers who need to consolidate multiple functions into a single programmable device while keeping board area and component count under control.

This device fits designs that prioritize predictable power requirements and commercial temperature operation, and it provides long-term value through a combination of integration, package density and regulatory compliance.

Request a quote or submit an inquiry to our sales team to discuss availability, pricing, and how the A3P600-2FGG256 can fit into your next design.