A3P600-1FG256

The A3P600-1FG256 is a ProASIC3 flash-based FPGA offered in a 256-LBGA package. It provides a balance of programmable logic, on-chip memory and I/O density for commercial embedded designs that require reprogrammable logic in a compact surface-mount package.

Key architectural attributes include 13,824 logic elements (LEs), approximately 110,592 bits of embedded RAM, up to 177 general-purpose I/Os and an effective gate capacity of 600,000 gates, combined with a low-voltage supply range and commercial operating temperature support.

Key Features

• Logic Fabric 13,824 logic elements (LEs) providing a programmable resource equivalent to 600,000 gates for implementing glue logic, state machines and custom data paths.
• Embedded Memory 110,592 bits of on-chip RAM (approximately 0.11 Mbits) for buffering, FIFOs and small-data storage close to logic.
• I/O Density Up to 177 general-purpose I/Os to support multiple parallel interfaces, peripheral connections and board-level routing flexibility.
• Package & Mounting Available in a 256-LBGA (supplier package: 256-FPBGA, 17×17) surface-mount package suited for space-conscious PCB layouts.
• Power Operates from a core supply range of 1.425 V to 1.575 V to match low-voltage system power domains.
• Temperature Grade Rated for commercial operation from 0°C to 85°C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Commercial embedded systems — Implement custom logic and control functions where up to 13,824 logic elements and 177 I/Os are required.
• Interface bridging and protocol conversion — Use on-chip RAM and abundant I/O to buffer and translate between parallel and serial domains within a commercial product design.
• Board-level glue logic — Replace multiple discrete components with programmable logic to reduce BOM and simplify PCB routing in compact 256-LBGA layouts.

Unique Advantages

• High logic capacity: 600,000 gates with 13,824 logic elements to implement substantial combinational and sequential logic on a single device.
• Integrated on-chip RAM: 110,592 bits of embedded memory for local buffering, lookup tables or small data storage without external RAM.
• Generous I/O count: 177 I/Os enable multiple peripheral connections and flexible board-level interfacing.
• Compact surface-mount package: 256-LBGA (17×17 FPBGA) provides a small footprint for space-constrained designs.
• Low-voltage core operation: 1.425 V to 1.575 V supply range aligns with common low-voltage system domains.
• Commercial temperature rating: 0°C to 85°C specification for mainstream commercial products.

Why Choose A3P600-1FG256?

The A3P600-1FG256 positions itself as a commercial-grade ProASIC3 FPGA that combines a substantial logic element count, embedded RAM and high I/O density in a compact 256-LBGA package. Its attributes make it suitable for designers seeking to consolidate logic, simplify board design and support multiple interfaces within a low-voltage commercial product.

This device is appropriate for development teams and OEMs targeting commercial embedded applications that require programmable logic capacity, local memory and flexible I/O while maintaining a compact surface-mount footprint and RoHS compliance.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P600-1FG256.