A3P600-1FG144

The A3P600-1FG144 is a ProASIC3 field programmable gate array (FPGA) IC from Microchip Technology designed for commercial-grade embedded designs. It provides 13,824 logic elements, approximately 110,592 bits of on-chip RAM, and up to 97 user I/Os in a compact 144-LBGA package.

This device targets designs that require mid-range logic density, on-chip memory, and a low-voltage supply operating between 1.425 V and 1.575 V, with an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  13,824 logic elements (cells) supporting up to 600,000 gates for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 110,592 bits of on-chip RAM to support buffering, lookup tables, and small data stores without external memory.
• I/O Count  97 user I/Os to interface with peripherals, sensors, and external devices directly from the FPGA fabric.
• Power  Low-voltage operation with a supply range from 1.425 V to 1.575 V to match system power domains.
• Package and Mounting  144-LBGA (supplier package: 144-FPBGA 13×13) in a surface-mount format for space-efficient board layouts.
• Operating Range  Commercial-grade temperature rating from 0 °C to 85 °C suitable for typical commercial environments.
• Compliance  RoHS-compliant construction supporting environmental requirements for lead-free assemblies.

Typical Applications

• Embedded Systems  Implement custom control logic, peripheral interfaces, and glue logic using the device's 13,824 logic elements and available on-chip RAM.
• Communications Equipment  Use the 97 I/Os and internal memory to handle protocol bridging, packet buffering, and interface adaptation in mid-range networking modules.
• Consumer Electronics  Integrate user interfaces, signal processing blocks, and custom state machines within a compact 144-LBGA footprint for space-constrained products.
• Test and Measurement  Create custom data acquisition front ends, timing controllers, or protocol test logic leveraging the device’s logic density and I/O count.

Unique Advantages

• High logic density: 13,824 logic elements and 600,000 gates enable substantial on-chip implementation of custom digital functions without immediate need for external ASICs.
• On-chip memory: Approximately 110,592 bits of embedded RAM reduce dependency on external memory for buffering and LUT storage, simplifying board design.
• Flexible I/O capacity: 97 user I/Os provide broad connectivity options for interfacing with sensors, peripherals, and external controllers.
• Compact, surface-mount package: The 144-LBGA (13×13 FPBGA) package supports small form-factor PCBs while maintaining sufficient pin count for complex designs.
• Commercial temperature rating: Designed for 0 °C to 85 °C operation to meet typical commercial application requirements.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing processes and environmental requirements.

Why Choose A3P600-1FG144?

The A3P600-1FG144 balances mid-range logic capacity, on-chip memory, and a high I/O count in a compact 144-LBGA package, making it well-suited for commercial embedded designs that need integrated digital logic and flexible interfacing. Its low-voltage supply and RoHS-compliant construction align with common system power domains and modern manufacturing requirements.

Backed by Microchip Technology, this ProASIC3 FPGA provides a practical option for engineers and procurement teams building mid-density programmable logic solutions where board space, I/O density, and embedded memory are important considerations.

Request a quote or submit an inquiry for pricing and availability of the A3P600-1FG144 to move your design forward.