A3P400-FGG144

The A3P400-FGG144 is a ProASIC3 Flash-based Field Programmable Gate Array (FPGA) IC offering 400,000 gates and 9,216 logic elements in a compact 144-ball LBGA package. It provides on-chip RAM and a moderate I/O count for applications that require programmable logic, embedded memory, and a surface-mount BGA footprint while operating within commercial temperature limits.

Key Features

• Core Logic 9,216 logic elements supporting a total of 400,000 gates for implementing custom digital logic and control functions.
• Embedded Memory 55,296 bits of on-chip RAM for local buffering, small data storage, and state machines.
• I/O Resources 97 I/O pins suitable for interfacing to peripherals, sensors, and buses in compact designs.
• Power Specified supply voltage range of 1.425 V to 1.575 V for core operation.
• Package & Mounting Surface-mount 144-LBGA package (supplier package: 144-FPBGA, 13×13 mm) for high-density board layouts.
• Temperature & Grade Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant.

Typical Applications

• Custom Logic and Glue Functions Implement application-specific combinational and sequential logic using 9,216 logic elements and 400,000 gates to replace discrete glue logic.
• Embedded Buffering and State Storage Use the 55,296 bits of on-chip RAM for small FIFO/buffer implementations and state machines.
• Peripheral and Sensor Interfaces Leverage 97 I/O pins for interfacing multiple peripherals, sensors, or low- to medium-pin-count external devices.
• Compact Board Designs The 144-LBGA (144-FPBGA 13×13) surface-mount package enables dense PCB layouts in space-constrained applications.

Unique Advantages

• Moderate gate capacity: 400,000 gates provide sufficient resources for mid-scale digital designs without over-provisioning.
• Significant logic density: 9,216 logic elements allow consolidation of multiple functions into a single device, reducing BOM count.
• On-chip memory: 55,296 bits of embedded RAM enables local data storage and buffering without external memory components.
• Compact BGA footprint: 144-LBGA / 144-FPBGA (13×13) packaging supports high-density board designs and reliable surface-mount assembly.
• Defined power envelope: Narrow core supply range (1.425 V–1.575 V) simplifies power-supply design and regulation considerations.
• RoHS compliant: Conforms to RoHS requirements for environmental compliance in commercial products.

Why Choose A3P400-FGG144?

The A3P400-FGG144 positions itself for designs that require a balanced combination of logic capacity, embedded memory, and a compact BGA package within a commercial temperature range. Its 9,216 logic elements and 400,000 gates provide a practical platform for consolidating mid-scale digital functions, while 55,296 bits of on-chip RAM reduce dependence on external memory.

This device is suited to engineers and procurement teams looking for a surface-mount, RoHS-compliant FPGA option with a well-defined supply-voltage window and a 97-pin I/O complement. The combination of integration, package density, and clear electrical and thermal limits supports reliable deployment in a range of commercial electronic systems.

Request a quote or submit your pricing inquiry to obtain availability and lead-time information for the A3P400-FGG144.