A3P400-FGG144I

The A3P400-FGG144I is a ProASIC3 field programmable gate array (FPGA) IC designed for industrial-grade embedded logic implementations. It provides a balanced combination of logic density, on-chip memory, and I/O count suitable for control, interface and custom logic functions in temperature-challenging environments.

With 9,216 logic elements and 400,000 gates in a compact 144-LBGA package, this device targets designers who need a moderate-density, surface-mount FPGA with defined supply and temperature specifications.

Key Features

• Logic Capacity  9,216 logic elements and 400,000 gates provide a foundation for medium-complexity digital designs and custom logic implementation.
• Embedded Memory  Approximately 0.055 Mbits of embedded memory (55,296 bits) for local storage, buffering and small lookup tables.
• I/O Resources  97 user I/O pins to support multiple peripheral interfaces and signal routing within constrained board layouts.
• Package and Mounting  144-LBGA package (supplier package: 144-FPBGA, 13×13) designed for surface-mount assembly to save board area.
• Power  Specified operating supply range of 1.425 V to 1.575 V for stable core operation within defined margins.
• Industrial Temperature Range  Rated for operation from -40 °C to 100 °C to meet elevated environmental requirements.
• Compliance  RoHS compliant to support lead-free manufacturing requirements.

Typical Applications

• Industrial Control  Use the FPGA for motor control logic, machine interface glue logic, and real-time decision-making where extended temperature range is required.
• Interface Bridging  Implement protocol conversion, parallel-to-serial bridging or custom bus interfacing using the device's 97 I/O pins and on-chip logic.
• Embedded Logic and Prototyping  Deploy as a compact programmable logic element for proof-of-concept designs, control subsystems, or feature integration in constrained board space.

Unique Advantages

• Compact, high-density logic: 9,216 logic elements and 400,000 gates provide substantial logic resources in a small package, reducing the need for multiple discrete ICs.
• Space-saving package: The 144-LBGA (144-FPBGA, 13×13) keeps board footprint minimal while delivering ample I/O and logic capacity.
• Industrial robustness: Rated for -40 °C to 100 °C operation to support deployments in temperature-stressed installations.
• Predictable power envelope: Narrow supply range (1.425 V to 1.575 V) helps simplify power-supply design and margining.
• RoHS compliant: Suitable for lead-free manufacturing processes and global regulatory requirements.
• Balanced I/O count: Ninety-seven I/O pins allow flexible interfacing to sensors, peripherals and other logic without excessive board-level routing complexity.

Why Choose A3P400-FGG144I?

The A3P400-FGG144I positions itself as a reliable mid-density FPGA option for industrial and embedded applications that require a defined set of logic resources, a compact BGA footprint, and operation across an extended temperature range. Its combination of 9,216 logic elements, 97 I/O pins, and a narrow core supply window provides a predictable platform for system designers focused on integration and manufacturability.

This device is suited to engineers and procurement teams building control systems, interface modules, and custom logic blocks where on-chip memory, logic density, and industrial temperature capability are required. The product delivers long-term value through a straightforward specification set that supports repeatable designs and consistent manufacturing outcomes.

Request a quote or submit an inquiry to obtain pricing and availability for the A3P400-FGG144I.