A3P400-FG256I

The A3P400-FG256I is a ProASIC3 field programmable gate array (FPGA) in a 256-LBGA package designed for industrial-grade applications. It provides 9,216 logic elements and approximately 0.055 Mbits of embedded memory, together with up to 178 I/O pins for implementing reconfigurable system logic.

With a defined core supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C, this device targets designs that require a compact, surface-mount FPGA offering substantial logic capacity and flexible I/O in a 17 mm × 17 mm FPBGA footprint.

Key Features

• Core Logic  9,216 logic elements (cells) providing the programmable fabric to implement custom digital functions and state machines.
• Logic Capacity  Approximately 400,000 gates to support medium-complexity logic and control implementations.
• Embedded Memory  55,296 total RAM bits (approximately 0.055 Mbits) for on-chip data buffering, FIFOs, and small lookup tables.
• I/O Count  178 general-purpose I/O pins to connect peripherals, buses, and external devices directly to the FPGA fabric.
• Power  Core voltage supply specified from 1.425 V to 1.575 V for deterministic power planning and regulator selection.
• Package and Mounting  256-LBGA (supplier device package: 256-FPBGA, 17×17) in a surface-mount form factor suitable for compact PCB layouts.
• Industrial Grade and Temperature  Rated for industrial operation with an operating temperature range of −40 °C to 100 °C.
• Environmental Compliance  RoHS compliant to meet common lead-free assembly requirements.

Typical Applications

• Industrial Control and Automation  Implement custom control logic and I/O aggregation using the device's 9,216 logic elements and 178 I/O pins in industrial environments.
• Protocol Bridging and Interface Logic  Use the available I/O and programmable fabric to implement protocol conversion or custom interface functions between subsystems.
• Embedded System Prototyping  Take advantage of reprogrammable logic and on-chip RAM for iterative development and validation of digital designs.

Unique Advantages

• Substantial Logic Capacity: 9,216 logic elements and roughly 400,000 gates provide headroom for medium-complexity designs without external logic.
• Generous I/O: 178 I/O pins enable direct connection to multiple peripherals, sensors, and bus interfaces, reducing the need for glue logic.
• Compact, Surface-Mount Package: The 256-LBGA (17×17 FPBGA) package balances I/O density and PCB real estate for space-constrained systems.
• Industrial Temperature Range: Qualified for −40 °C to 100 °C operation to support applications that require extended temperature tolerance.
• Predictable Power Requirements: A specified core voltage range of 1.425 V to 1.575 V simplifies power-supply selection and thermal planning.
• RoHS Compliant: Meets lead-free assembly requirements for environmental compliance.

Why Choose A3P400-FG256I?

The A3P400-FG256I positions itself as a versatile industrial-grade ProASIC3 FPGA offering a balance of logic density, embedded memory, and I/O capacity in a compact 256-LBGA surface-mount package. Its specified supply voltage and wide operating temperature range make it suitable for designs that require deterministic power design and operation across demanding environmental conditions.

This device is well suited for engineering teams developing industrial control, interface, or embedded prototyping projects that need reconfigurable logic, significant I/O, and compact packaging while maintaining RoHS compliance.

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