A3P400-2PQG208

The A3P400-2PQG208 is a ProASIC3 flash-based FPGA provided by Microchip Technology, offering mid-density programmable logic in a surface-mount PQFP package. With 9,216 logic elements and 151 user I/Os, this device is suited to designs that require a balance of logic capacity, I/O count, and on-chip memory within a commercial temperature range.

Its supply voltage window and RoHS compliance make it appropriate for commercial-electronics applications where predictable operating conditions and regulatory conformity are required.

Key Features

• Core Logic 9,216 logic elements and an estimated 400,000 gates provide mid-density programmable logic resources for control, glue-logic, and subsystem integration.
• Embedded Memory 55,296 bits of on-chip RAM (approximately 0.055 Mbits) for small buffering, FIFOs, and lookup tables.
• I/O Resources 151 user I/Os to support parallel interfacing, multiple peripherals, and board-level connectivity.
• Power Supply Operates from a core supply range of 1.425 V to 1.575 V to match system power rails and design constraints.
• Package & Mounting Available in a 208-BFQFP / 208-PQFP (28 × 28 mm) surface-mount package for high-pin-count board designs.
• Temperature & Grade Commercial-grade device specified for 0 °C to 85 °C operation.
• Environmental Compliance RoHS compliant for environmental regulatory alignment.

Typical Applications

• I/O-rich control and interfacing — 151 I/Os enable integration of multiple sensors, peripherals, and bus interfaces on a single device.
• Mid-density logic integration — 9,216 logic elements and ~400k gates support glue logic, protocol bridging, and custom control functions.
• Embedded buffering and small data structures — 55,296 bits of on-chip RAM are useful for small FIFOs, lookup tables, and local data storage.
• Compact board-level integration — 208-pin PQFP package allows high-pin-count designs in a compact surface-mount form factor.

Unique Advantages

• Balanced logic density: 9,216 logic elements provide capacity for mid-range programmable functions without overprovisioning.
• Generous I/O count: 151 user I/Os simplify system integration and reduce the need for external multiplexing or additional devices.
• On-chip RAM for local data handling: 55,296 bits of embedded memory enable efficient buffering and small lookup implementations on the FPGA.
• Compact, high-pin-count package: The 208-PQFP (28 × 28) surface-mount package supports dense routing and high signal count in a standard PCB footprint.
• Commercial temperature suitability: Rated for 0 °C to 85 °C operation to match common commercial-electronics environments.
• Regulatory alignment: RoHS compliance supports product designs targeting environmental regulatory requirements.

Why Choose A3P400-2PQG208?

The A3P400-2PQG208 positions itself as a practical, flash-based FPGA choice for commercial designs that need a mid-density logic fabric with substantial I/O and modest on-chip memory. Its combination of 9,216 logic elements, 151 I/Os, and a 208-pin surface-mount package makes it well suited for system integration tasks where board space and pin count matter.

For engineering teams designing control logic, interface bridging, or small-scale embedded processing blocks within a commercial temperature range, this device offers a clear set of verifiable resources and regulatory compliance to support production-ready designs.

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