A3P400-2FGG256

The A3P400-2FGG256 is a ProASIC3 field programmable gate array (FPGA) from Microchip Technology. It provides 9,216 logic elements (cells), approximately 55 Kbits of on-chip RAM, and 178 general-purpose I/O pins in a 256-ball BGA package.

Designed for surface-mount placement and commercial-temperature operation, this device is suited to designs that require programmable logic capacity with a defined operating voltage range and package footprint.

Key Features

• Logic Capacity  9,216 logic elements (cells) and approximately 400,000 equivalent gates to implement custom digital functions and moderate-complexity state machines.
• On‑Chip Memory  Total embedded memory of 55,296 bits (approximately 55 Kbits) to support buffering, small lookup tables, and local data storage.
• I/O Resources  178 available I/O pins for interfacing with peripherals, sensors, and external logic devices.
• Power  Specified supply voltage range of 1.425 V to 1.575 V to match systems designed around this core voltage.
• Package & Mounting  256-ball LBGA package (supplier device package: 256-FPBGA, 17×17) with surface-mount mounting suitable for modern PCB assembly processes.
• Operating Range  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS compliant, meeting common lead-free environmental requirements.

Typical Applications

• Embedded Control  Implement custom control logic, state machines, and protocol bridging where 9,216 logic elements and 178 I/O provide required resources.
• Interface and Glue Logic  Consolidate discrete logic functions and manage multiple peripheral interfaces using available I/O and on-chip memory.
• Data Acquisition  Buffer and preprocess sensor or peripheral data with on-chip RAM and programmable logic before handing off to a host processor.

Unique Advantages

• Defined Logic Density:  9,216 logic elements and 400,000 gates give clear implementation capacity for designers planning resource budgets.
• On‑Chip Memory for Local Storage:  Approximately 55 Kbits of embedded RAM reduces dependence on external memory for small buffers and LUTs.
• Generous I/O Count:  178 I/O pins enable flexible interfacing to multiple subsystems without additional I/O expanders.
• Standard BGA Package:  256-ball LBGA (256-FPBGA 17×17) provides a compact, production-friendly footprint for modern PCBs.
• Predictable Power Envelope:  A specified supply range of 1.425 V to 1.575 V supports consistent power design and verification.
• RoHS Compliant:  Conforms to lead‑free environmental requirements for streamlined qualification in many markets.

Why Choose A3P400-2FGG256?

The A3P400-2FGG256 offers a clearly defined combination of logic capacity, on‑chip memory, and I/O count in a compact 256-ball BGA package from Microchip Technology. Its documented operating voltage and commercial temperature range make it suitable for a wide range of embedded and interface-focused designs that require programmable logic within these parameters.

This part is appropriate for teams and designs that need transparent resource sizing (logic elements, gates, RAM, and I/O) and prefer an FPGA solution packaged for surface-mount assembly with RoHS compliance. It provides a straightforward platform for implementing custom digital functions while aligning with established PCB and power design constraints.

Request a quote or submit an inquiry for pricing and availability to evaluate the A3P400-2FGG256 for your next design.