A3P400-2FG144

The A3P400-2FG144 is a ProASIC3 field programmable gate array (FPGA) offering 9,216 logic elements and 55,296 bits of on-chip RAM. It provides 97 user I/Os and an internal gate-equivalent count of 400,000 packaged in a 144-LBGA (supplier package: 144-FPBGA, 13×13) surface-mount device.

Operating from 1.425 V to 1.575 V and rated for commercial temperature operation (0 °C to 85 °C), this device is suited for designs that require a balance of moderate logic capacity, embedded memory, and a compact BGA footprint.

Key Features

• Core Logic  9,216 logic elements and 400,000 gate equivalents provide moderate programmable logic capacity for glue logic, finite-state machines, and custom processing blocks.
• Embedded Memory  55,296 bits of on-chip RAM for local data buffering and small lookup tables.
• I/O Count  97 user I/Os to support multiple peripheral interfaces and signal connections on a single device.
• Power  Specified supply voltage range of 1.425 V to 1.575 V for core operation.
• Package & Mounting  144-LBGA (supplier: 144-FPBGA, 13×13) in a surface-mount form factor for space-efficient board designs.
• Temperature & Grade  Commercial grade operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS-compliant.

Typical Applications

• Embedded control and glue logic  Use the 9,216 logic elements and 97 I/Os to consolidate discrete logic and manage interface bridging within embedded systems.
• Compact, space-constrained systems  The 144-LBGA surface-mount package and integrated resources make the device appropriate for designs where board area is limited.
• Custom I/O concentrators  Support multiple signals and peripheral interfaces using the available I/O count and on-chip memory for short-term buffering.

Unique Advantages

• Balanced logic and memory resources: 9,216 logic elements combined with 55,296 bits of RAM deliver a balanced platform for moderate-density programmable logic functions.
• High I/O count in a compact footprint: 97 user I/Os in a 144-LBGA package help reduce the need for external I/O expanders and simplify board routing.
• Surface-mount BGA for dense layouts: The 13×13 144-FPBGA supplier package enables efficient use of PCB real estate in compact assemblies.
• Tightly specified core voltage: A 1.425 V–1.575 V supply range supports predictable power provisioning and integration with matched power rails.
• RoHS-compliant and commercial grade: Environmentally compliant construction and a 0 °C to 85 °C operating range aligned with commercial applications.

Why Choose A3P400-2FG144?

The A3P400-2FG144 positions itself as a mid-density ProASIC3 FPGA option that combines a practical balance of logic elements, on-chip RAM, and a substantial I/O count in a compact 144-LBGA footprint. Its defined voltage window and commercial temperature rating make it a straightforward choice for designers targeting space-constrained, board-level programmable logic solutions.

For teams needing predictable build integration, the device’s surface-mount BGA package and RoHS compliance support modern manufacturing flows while providing enough logic and memory resources for a wide range of embedded tasks.

Request a quote today to check pricing and availability for the A3P400-2FG144 and to receive a formal quotation for your procurement or project needs.