A3P400-1PQ208
| Part Description |
ProASIC3 Field Programmable Gate Array (FPGA) IC 151 55296 208-BFQFP |
|---|---|
| Quantity | 1,135 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 208-PQFP (28x28) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 208-BFQFP | Number of I/O | 151 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 9216 | Number of Logic Elements/Cells | 9216 | ||
| Number of Gates | 400000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 55296 |
Overview of A3P400-1PQ208 – ProASIC3 FPGA, 208-BFQFP
The A3P400-1PQ208 is a ProASIC3 Field Programmable Gate Array (FPGA) IC provided in a 208-pin BFQFP package. It delivers a moderate-density programmable logic resource set intended for commercial embedded logic and control applications.
With 9216 logic elements, approximately 55 Kbits of embedded memory, 151 user I/O pins and 400,000 gates, the device is targeted at designs that require a balance of logic capacity, on‑chip memory and I/O connectivity within a defined commercial temperature and supply range.
Key Features
- Core Logic 9216 logic elements and 400,000 gates provide the device's primary programmable logic capacity for implementing combinational and sequential logic functions.
- Embedded Memory Approximately 55 Kbits of on-chip RAM for data buffering, small FIFOs and state storage within user designs.
- I/O and Connectivity 151 user I/O pins to support parallel interfaces, bus connections and mixed-signal front-end interfacing at the package level.
- Power Specified supply voltage range of 1.425 V to 1.575 V to match system power-rail design and budgeting.
- Package and Mounting 208-BFQFP package (supplier device package: 208-PQFP, 28×28) in a surface-mount form factor for standard PCB assembly processes.
- Operating Range and Grade Commercial grade device specified for 0 °C to 85 °C operating temperature and RoHS compliance for environmental regulatory alignment.
Typical Applications
- Embedded Control Implement glue logic, finite-state machines and control functions in commercial embedded systems using on-chip logic and memory.
- I/O Expansion and Protocol Bridging Use the 151 I/O pins for parallel interfacing, bus bridging or protocol translation in compact designs.
- Prototyping and Evaluation Suitable for evaluating mid-density FPGA implementations where defined supply and temperature specifications are required.
Unique Advantages
- Balanced logic density: 9216 logic elements and 400,000 gates provide solid implementation capacity for mid-range FPGA designs.
- On-chip memory for buffering: Approximately 55 Kbits of embedded RAM supports local data storage without external memory.
- High I/O count: 151 user I/Os enable extensive connectivity options for interfacing with peripherals and buses.
- Defined supply window: Operation across a 1.425 V to 1.575 V supply range simplifies power-rail planning.
- Standard package and assembly: 208-BFQFP / 208-PQFP (28×28) surface-mount package fits common PCB assembly flows.
- Commercial temperature and RoHS compliance: Specified for 0 °C to 85 °C operation and RoHS status marked as compliant for environmentally regulated designs.
Why Choose A3P400-1PQ208?
The A3P400-1PQ208 positions itself as a reliable, commercial-grade ProASIC3 FPGA option for designers who need a mid-density programmable device with substantial I/O and on‑chip memory. Its defined voltage and temperature specifications, combined with a standard 208-pin surface-mount package, make it straightforward to integrate into space-constrained boards and established assembly processes.
This part is well suited to teams implementing embedded control, interface bridging or prototype logic where predictable electrical and thermal boundaries and RoHS compliance are required. The combination of logic elements, gates, embedded RAM and I/O count offers a practical balance of resources for many commercial applications.
Request a quote or submit an inquiry to receive pricing and availability information for the A3P400-1PQ208.

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