A3P400-1FGG256

The A3P400-1FGG256 is a ProASIC3 FPGA IC from Microchip Technology designed for commercial embedded logic applications. It provides a balanced combination of logic capacity, on-chip memory, and I/O density in a compact 256-LBGA package.

This device is suitable for designs requiring approximately 9,216 logic elements, 55,296 bits of embedded memory, and up to 178 I/O pins, operating from a 1.425 V to 1.575 V supply over a commercial 0 °C to 85 °C temperature range.

Key Features

• Logic Capacity  Approximately 9,216 logic elements (LEs) providing moderate complexity programmable logic for control, glue-logic, and mid-range FPGA designs.
• On-Chip Memory  Approximately 55,296 bits of embedded memory for buffering, small data tables, and state storage within the FPGA fabric.
• I/O Density  178 general-purpose I/O pins to support multiple peripherals, sensors, and external interfaces in a single device.
• Gate Count  400,000 gates enabling integration of combinational and sequential logic blocks for typical embedded applications.
• Power and Voltage  Operates from a 1.425 V to 1.575 V supply, suitable for low-voltage system designs.
• Package and Mounting  256-LBGA (supplier device package: 256-FPBGA 17×17) in a surface-mount form factor for space-efficient PCB layouts.
• Commercial Temperature Range  Rated for 0 °C to 85 °C operation for mainstream commercial applications.
• Environmental Compliance  RoHS compliant, supporting regulatory-driven product designs.

Typical Applications

• Embedded Control  Use the FPGA to implement custom control logic, timing, and interfacing for embedded systems that need moderate logic and on-chip memory.
• Peripheral and Sensor Interfacing  Leverage 178 I/O pins to aggregate signals from sensors, actuators, and external peripherals in single-board solutions.
• Communications and Networking  Deploy as protocol glue-logic, packet handling, or interface bridging where configurable logic and memory are required.
• Prototyping and Development  A suitable platform for validating designs that require mid-range FPGA resources and commercial-temperature operation.

Unique Advantages

• Balanced Logic and Memory  Combines approximately 9,216 logic elements with about 55,296 bits of embedded memory to support mixed control and data storage tasks on-chip.
• High I/O Count  178 I/O pins reduce the need for external multiplexers or expanders when integrating multiple peripherals and interfaces.
• Compact LBGA Package  256-LBGA (17×17 FPBGA) offers a compact, surface-mount footprint for space-constrained PCB designs.
• Low-Voltage Operation  Design around a 1.425 V to 1.575 V supply to align with modern low-voltage system rails.
• Commercial Temperature Suitability  Rated for 0 °C to 85 °C operation to meet standard commercial product environmental ranges.
• Regulatory Compliance  RoHS compliant to support environmental and manufacturing requirements.

Why Choose A3P400-1FGG256?

The A3P400-1FGG256 positions itself as a practical FPGA choice for commercial embedded designs that need a mid-range mix of logic, memory, and I/O in a compact package. Its combination of roughly 9,216 logic elements, 55,296 bits of embedded RAM, and 178 I/O pins provides designers with the capability to consolidate discrete logic, interfaces, and buffering into a single device.

Manufactured by Microchip Technology and delivered in a 256-LBGA surface-mount package, this device offers a reliable option for developers building consumer, communications, and general-purpose embedded systems that operate within a 0 °C to 85 °C temperature range.

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