A3P400-1PQG208

The A3P400-1PQG208 is a commercial-grade ProASIC3 Flash FPGA from Microchip Technology. It provides on-chip reprogrammable logic with a combination of logic elements, embedded memory, and a substantial I/O count for compact, programmable designs.

Designed for commercial embedded applications, this device delivers 9,216 logic elements, approximately 0.055 Mbits of embedded memory, and 151 I/Os in a surface-mount 208-BFQFP package, making it suitable for designs that require moderate gate density and flexible I/O integration.

Key Features

• Logic Capacity — 9,216 logic elements and 400,000 equivalent gates provide a balanced resource set for medium-complexity digital designs.
• Embedded Memory — Total on-chip RAM of 55,296 bits (approximately 0.055 Mbits) for local data buffering and state storage.
• I/O Resources — 151 available I/Os to support multiple interfacing and peripheral connections within a single device.
• Power Supply — Single-core voltage range of 1.425 V to 1.575 V for predictable power planning.
• Package and Mounting — Available in a 208-BFQFP surface-mount package (supplier device package: 208-PQFP, 28×28) to suit compact PCB layouts.
• Operating Conditions — Commercial operating temperature range from 0 °C to 85 °C and RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Commercial Embedded Systems — Implements custom control and processing functions where reprogrammable logic and a defined commercial temperature range are required.
• I/O Expansion and Interface Bridging — Uses the 151 I/Os to consolidate peripheral interfaces and protocol adaptation within a single package.
• Custom Digital Logic and Prototyping — Provides 9,216 logic elements and on-chip memory for developing and validating medium-complexity custom logic blocks.

Unique Advantages

• Balanced Logic Density: 9,216 logic elements and 400,000 gates deliver sufficient capacity for medium-scale designs without excessive board-level complexity.
• Compact, Surface-Mount Packaging: 208-BFQFP (208-PQFP, 28×28) enables high-density PCB integration while keeping a standardized footprint.
• Generous I/O Count: 151 I/Os allow consolidation of multiple signals and interfaces, reducing the need for additional interface chips.
• Predictable Power Envelope: Narrow core supply range (1.425–1.575 V) simplifies power-supply design and voltage budgeting.
• Commercial Temperature Suitability: Rated for 0 °C to 85 °C operation to meet typical commercial product requirements.
• RoHS Compliant: Meets RoHS environmental requirements for reduced hazardous substances.

Why Choose A3P400-1PQG208?

The A3P400-1PQG208 positions itself as a practical, commercially graded FPGA option for designers who need a mid-range mix of logic elements, embedded memory, and I/O density in a compact, surface-mount package. Its specifications suit projects that require reprogrammable logic without the footprint or power demands of larger FPGA families.

Backed by Microchip Technology, this ProASIC3 device is appropriate for development teams and procurement groups targeting commercial embedded systems, interface consolidation, or custom logic prototyping that value predictable electrical and thermal characteristics along with RoHS compliance.

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