A3P400-1FGG256I

The A3P400-1FGG256I is a ProASIC3 field programmable gate array (FPGA) designed for industrial applications. It provides 9,216 logic elements and approximately 0.055 Mbits of embedded memory, with a broad I/O complement and a compact 256-LBGA package for surface-mount assembly.

With an operating range from –40 °C to 100 °C and a defined supply voltage window of 1.425 V to 1.575 V, this device is positioned for robust, temperature-tolerant embedded and industrial designs that require mid-density logic, flexible I/O, and board-level integration.

Key Features

• Core Logic: 9,216 logic elements (equivalent logic cells) providing up to 400,000 gates for mid-density FPGA implementations.
• Embedded Memory: Approximately 0.055 Mbits of on-chip RAM (55 Kbits) to support buffering, small FIFOs, and local data storage.
• I/O Capacity: 178 user I/O pins to support multiple interfaces, parallel buses, and signal conditioning on a single device.
• Power Supply: Defined supply voltage range of 1.425 V to 1.575 V for predictable power budgeting and system-level design.
• Package and Mounting: 256-LBGA package (supplier device package: 256-FPBGA, 17×17) optimized for surface-mount PCB assembly and compact system footprints.
• Industrial Grade: Specified operating temperature from –40 °C to 100 °C, suitable for temperature-tolerant industrial environments.

Typical Applications

• Industrial Control: Use the device’s industrial temperature rating and extensive I/O to implement custom control logic, sequencing, and interface bridging in factory and process automation equipment.
• Embedded Systems: Mid-density logic and on-chip RAM enable integration of glue logic, protocol handling, and peripheral control in embedded platforms.
• Instrumentation and Test: High I/O count and programmable logic density support data acquisition front-ends, signal aggregation, and real-time preprocessing tasks.

Unique Advantages

• Balanced Logic and Memory: 9,216 logic elements paired with embedded RAM provide a balanced resource set for designs that require both combinational logic and modest on-chip storage.
• High I/O Density: 178 I/O pins reduce the need for external multiplexing components and simplify board-level routing for multi-interface designs.
• Compact, Assembly-Ready Package: The 256-LBGA (256-FPBGA, 17×17) package supports a small PCB footprint while maintaining assembly compatibility with surface-mount processes.
• Defined Supply and Thermal Range: A clear supply voltage window (1.425–1.575 V) and industrial operating temperature range help streamline system power and thermal design decisions.
• Industrial Grade Specification: Specified for –40 °C to 100 °C operation, enabling deployment in harsher environments where temperature resilience is required.

Why Choose A3P400-1FGG256I?

The A3P400-1FGG256I delivers a practical combination of mid-range logic capacity, meaningful on-chip memory, and a substantial I/O complement in a compact BGA package. Its industrial temperature rating and clearly defined supply requirements make it a straightforward choice for embedded and industrial engineers seeking a reliable, surface-mount FPGA for custom logic, interface consolidation, and control applications.

This device suits designs that need moderate logic density with robust environmental tolerance, offering scalability within systems that demand predictable electrical and thermal behavior. The A3P400-1FGG256I is an option for projects that prioritize integration, I/O flexibility, and board-level compactness.

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