A3P400-1FG256I

The A3P400-1FG256I is a ProASIC3 field programmable gate array from Microchip Technology delivering a balanced mix of logic capacity, I/O density and on-chip memory for embedded programmable logic designs. The device integrates 9,216 logic elements, 55,296 bits of on-chip RAM and up to 178 I/O pins in a 256‑LBGA surface-mount package.

Designed for industrial environments, this FPGA operates across a supply range of 1.425 V to 1.575 V and a temperature range of -40 °C to 100 °C, making it suitable for designs that require robust electrical and thermal margins.

Key Features

• Logic Capacity  9,216 logic elements (cells) and approximately 400,000 gates to implement custom digital functions and state machines.
• Embedded Memory  Total on-chip RAM of 55,296 bits to support FIFO buffers, small data tables and local storage for logic operations.
• I/O Density  Up to 178 general-purpose I/O pins to interface with external peripherals, sensors and buses.
• Power  Specified supply voltage range from 1.425 V to 1.575 V for core operation.
• Package and Mounting  256‑LBGA (supplier device package: 256‑FPBGA, 17×17) in a surface-mount footprint for high-density PCB designs.
• Operating Range  Industrial-grade operating temperature from -40 °C to 100 °C for reliable operation in challenging environments.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use in programmable logic control and automation systems that require industrial temperature operation and a reliable programmable fabric.
• I/O-Intensive Interfaces  Ideal for designs that need a high number of general-purpose I/O pins to connect sensors, actuators or external buses.
• Embedded Logic Implementation  Deployment as the programmable logic element in embedded systems requiring moderate on-chip RAM and a flexible gate count.

Unique Advantages

• Balanced Logic and Memory:  9,216 logic elements paired with 55,296 bits of RAM provide a practical mix for implementing control logic, data buffering and small lookup tables without external memory.
• High I/O Count:  178 I/O pins reduce the need for external I/O expanders and simplify board-level connectivity.
• Industrial Temperature Rating:  Operation from -40 °C to 100 °C supports deployment in industrial environments where extended temperature tolerance is required.
• Compact, Surface-Mount Package:  256‑LBGA (256‑FPBGA, 17×17) enables a compact PCB footprint for space-constrained designs while supporting robust soldered mounting.
• Stable Core Voltage Window:  Defined supply range (1.425 V to 1.575 V) helps ensure predictable core operation and easier power-supply design.
• Regulatory Compliance:  RoHS compliance simplifies environmental qualification for many product lines.

Why Choose A3P400-1FG256I?

The A3P400-1FG256I delivers a practical combination of logic capacity, embedded RAM and a high I/O count in a compact 256‑LBGA package, making it well suited to engineers developing industrial and embedded programmable logic solutions. Its specified supply range and industrial temperature rating support robust operation within demanding electrical and thermal environments.

Manufactured by Microchip Technology and built on the ProASIC3 family, the device is positioned for designs that require reliable programmable logic with moderate resource needs, compact packaging and compliance with RoHS environmental requirements.

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