A3P400-1FG144

The A3P400-1FG144 is a ProASIC3 field programmable gate array (FPGA) IC provided in a 144-ball LBGA package. It delivers a mid-density programmable logic solution with 9216 logic elements and approximately 0.055 Mbits of embedded memory for commercial embedded designs.

Designed for surface-mount assembly and RoHS compliance, this device targets commercial applications that require configurable logic, moderate on-chip memory, and a compact BGA footprint.

Key Features

• Logic Capacity — 9216 logic elements supporting up to 400,000 gates for mid-density programmable logic implementations.
• Embedded Memory — Approximately 0.055 Mbits (55,296 bits) of on-chip RAM to support local buffering and data storage within logic designs.
• I/O Count — 97 user I/O pins to connect peripherals, interfaces, and external devices.
• Power — Operates from a core supply range of 1.425 V to 1.575 V, enabling integration with low-voltage system domains.
• Package & Mounting — 144-LBGA package (Supplier device package: 144-FPBGA 13×13) in a surface-mount form factor for compact board layouts.
• Operating Range — Commercial temperature grade rated from 0 °C to 85 °C for typical commercial-environment deployments.
• Regulatory — RoHS compliant to meet common environmental requirements for electronic assemblies.

Typical Applications

• Commercial embedded systems — Implement custom control logic and peripheral interfacing using 9216 logic elements and 97 I/Os.
• Mid-density logic integration — Replace multiple discrete components with a single programmable device for designs requiring up to 400,000 gates.
• Compact board designs — Use the 144-LBGA surface-mount package to conserve PCB area while maintaining ample I/O and logic resources.

Unique Advantages

• Balanced logic and memory — Combines 9216 logic elements with approximately 0.055 Mbits of embedded RAM to support both combinational and stateful functions on-chip.
• Substantial gate count — Up to 400,000 gates enables consolidation of multiple functions into a single FPGA, reducing BOM complexity.
• Flexible I/O — 97 I/O pins accommodate a wide range of peripheral connections and interface needs without external I/O expanders.
• Compact BGA footprint — 144-FPBGA (13×13) package lets you design smaller, denser PCB layouts for space-constrained products.
• Commercial temperature and RoHS compliant — Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments and regulatory alignment.
• Low-voltage core — Core supply range of 1.425 V to 1.575 V supports integration with low-voltage system architectures.

Why Choose A3P400-1FG144?

The A3P400-1FG144 positions itself as a practical mid-density FPGA for commercial applications that need a balance of logic elements, embedded memory, and a substantial I/O count in a compact BGA package. Its 9216 logic elements and up to 400,000 gates support consolidation of multiple functions into a single programmable device, simplifying design and reducing component count.

With a surface-mount 144-LBGA footprint, RoHS compliance, commercial temperature rating, and a defined low-voltage core supply range, this device is suitable for designers and procurement teams targeting scalable, reliable programmable-logic solutions for commercial products.

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