A3PN030-Z1QNG68

IC FPGA 49 I/O 68QFN
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad

Quantity 1,181 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package68-QFN (8x8)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case68-VFQFN Exposed PadNumber of I/O49Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells768
Number of Gates30000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3PN030-Z1QNG68 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 49 I/O, 68-VFQFN Exposed Pad

The A3PN030-Z1QNG68 is a ProASIC3 nano field programmable gate array (FPGA) from Microchip Technology, delivered in a 68-VFQFN exposed pad package. It provides approximately 768 logic elements (about 30,000 gates) and 49 user I/O pins in a compact surface-mount package, with a specified core voltage range and commercial temperature rating for mainstream embedded designs.

This device is suited to compact logic integration tasks where a defined count of logic elements and I/O are required, and where a QFN exposed-pad package and surface-mount assembly are preferred.

Key Features

  • Logic Capacity — Approximately 768 logic elements (listed as 768 LABs/CLBs) providing roughly 30,000 gates for small to mid-size logic integration.
  • I/O and Connectivity — 49 available I/O pins to support peripheral interfacing and control signals in compact systems.
  • On-chip Memory — No embedded RAM (Total RAM Bits: 0), suitable for designs that rely on external memory or are optimized for pure logic and glue functions.
  • Power Supply — Core voltage supply specified from 1.425 V to 1.575 V for consistent power design and supply selection.
  • Package and Mounting — 68-VFQFN exposed pad package (supplier package listed as 68-QFN, 8×8) offered in a surface-mount form factor for compact PCB layouts.
  • Temperature and Grade — Commercial grade with an operating temperature range of −20 °C to 85 °C, aligning with standard commercial embedded applications.
  • Environmental Compliance — RoHS compliant, supporting lead-free assembly and regulatory requirements for many electronics markets.

Typical Applications

  • Embedded Control Logic — Implement control, state machines, and finite-state logic where approximately 768 logic elements and 49 I/O pins meet the design requirements.
  • I/O Expansion and Glue Logic — Provide signal aggregation, protocol bridging, or interface adaptation in systems that require a compact surface-mount FPGA solution.
  • Compact Board Designs — Use the 68-VFQFN exposed pad package for space-constrained PCBs needing a QFN-format programmable logic device.

Unique Advantages

  • Right-sized Logic Resources: Approximately 768 logic elements and ~30k gates give predictable capacity for small to mid-scale designs without unnecessary overhead.
  • Clear I/O Count: 49 I/O pins simplify pin budgeting for peripheral interfaces and control signals.
  • Compact Surface-Mount Package: 68-VFQFN exposed pad in an 8×8 QFN outline enables compact PCB layouts and standard surface-mount assembly techniques.
  • Tightly Specified Core Voltage: A defined supply range of 1.425 V to 1.575 V helps streamline power supply selection and design.
  • Commercial Temperature Range: Rated from −20 °C to 85 °C to meet typical commercial application environments.
  • RoHS Compliant: Conforms to lead-free manufacturing and environmental compliance needs.

Why Choose A3PN030-Z1QNG68?

The A3PN030-Z1QNG68 combines a compact 68-VFQFN exposed-pad package with approximately 768 logic elements and 49 I/O pins, making it a practical choice for designers who need a predictable, surface-mount FPGA solution for small to mid-size logic integration. Its defined core voltage range and commercial operating temperature provide clear electrical and thermal boundaries for system design.

Manufactured by Microchip Technology and delivered in a RoHS-compliant package, this device is appropriate for embedded designs that prioritize compact footprint, straightforward power requirements, and a moderate logic/I/O budget.

Request a quote or submit a price inquiry to evaluate A3PN030-Z1QNG68 for your next design project and to obtain availability and purchasing details.

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