A3PN030-Z1QNG68
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad |
|---|---|
| Quantity | 1,181 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 68-QFN (8x8) | Grade | Commercial | Operating Temperature | -20°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 68-VFQFN Exposed Pad | Number of I/O | 49 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 768 | ||
| Number of Gates | 30000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3PN030-Z1QNG68 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 49 I/O, 68-VFQFN Exposed Pad
The A3PN030-Z1QNG68 is a ProASIC3 nano field programmable gate array (FPGA) from Microchip Technology, delivered in a 68-VFQFN exposed pad package. It provides approximately 768 logic elements (about 30,000 gates) and 49 user I/O pins in a compact surface-mount package, with a specified core voltage range and commercial temperature rating for mainstream embedded designs.
This device is suited to compact logic integration tasks where a defined count of logic elements and I/O are required, and where a QFN exposed-pad package and surface-mount assembly are preferred.
Key Features
- Logic Capacity — Approximately 768 logic elements (listed as 768 LABs/CLBs) providing roughly 30,000 gates for small to mid-size logic integration.
- I/O and Connectivity — 49 available I/O pins to support peripheral interfacing and control signals in compact systems.
- On-chip Memory — No embedded RAM (Total RAM Bits: 0), suitable for designs that rely on external memory or are optimized for pure logic and glue functions.
- Power Supply — Core voltage supply specified from 1.425 V to 1.575 V for consistent power design and supply selection.
- Package and Mounting — 68-VFQFN exposed pad package (supplier package listed as 68-QFN, 8×8) offered in a surface-mount form factor for compact PCB layouts.
- Temperature and Grade — Commercial grade with an operating temperature range of −20 °C to 85 °C, aligning with standard commercial embedded applications.
- Environmental Compliance — RoHS compliant, supporting lead-free assembly and regulatory requirements for many electronics markets.
Typical Applications
- Embedded Control Logic — Implement control, state machines, and finite-state logic where approximately 768 logic elements and 49 I/O pins meet the design requirements.
- I/O Expansion and Glue Logic — Provide signal aggregation, protocol bridging, or interface adaptation in systems that require a compact surface-mount FPGA solution.
- Compact Board Designs — Use the 68-VFQFN exposed pad package for space-constrained PCBs needing a QFN-format programmable logic device.
Unique Advantages
- Right-sized Logic Resources: Approximately 768 logic elements and ~30k gates give predictable capacity for small to mid-scale designs without unnecessary overhead.
- Clear I/O Count: 49 I/O pins simplify pin budgeting for peripheral interfaces and control signals.
- Compact Surface-Mount Package: 68-VFQFN exposed pad in an 8×8 QFN outline enables compact PCB layouts and standard surface-mount assembly techniques.
- Tightly Specified Core Voltage: A defined supply range of 1.425 V to 1.575 V helps streamline power supply selection and design.
- Commercial Temperature Range: Rated from −20 °C to 85 °C to meet typical commercial application environments.
- RoHS Compliant: Conforms to lead-free manufacturing and environmental compliance needs.
Why Choose A3PN030-Z1QNG68?
The A3PN030-Z1QNG68 combines a compact 68-VFQFN exposed-pad package with approximately 768 logic elements and 49 I/O pins, making it a practical choice for designers who need a predictable, surface-mount FPGA solution for small to mid-size logic integration. Its defined core voltage range and commercial operating temperature provide clear electrical and thermal boundaries for system design.
Manufactured by Microchip Technology and delivered in a RoHS-compliant package, this device is appropriate for embedded designs that prioritize compact footprint, straightforward power requirements, and a moderate logic/I/O budget.
Request a quote or submit a price inquiry to evaluate A3PN030-Z1QNG68 for your next design project and to obtain availability and purchasing details.

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