A3PN030-Z1QNG48I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 34 48-VFQFN Exposed Pad |
|---|---|
| Quantity | 1,238 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 48-QFN (6x6) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 48-VFQFN Exposed Pad | Number of I/O | 34 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 768 | ||
| Number of Gates | 30000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3PN030-Z1QNG48I – ProASIC3 nano FPGA, 34 I/O, 48-VFQFN
The A3PN030-Z1QNG48I is a ProASIC3 nano field programmable gate array (FPGA) IC from Microchip Technology. It implements a flash-based FPGA fabric with 768 logic elements and approximately 30,000 gates, aimed at compact, industrial-grade embedded designs.
Designed for low-power operation and flexible interfacing, this device provides 34 user I/Os in a 48‑VFQFN exposed pad (48‑QFN, 6×6 mm) surface-mount package, with an operating voltage range of 1.425 V to 1.575 V and an industrial temperature rating from -40 °C to 100 °C.
Key Features
- Core Logic 768 logic elements (LEs) enabling up to 30,000 gates of user logic for custom digital functions.
- I/O Count 34 user I/Os suitable for interfacing to sensors, actuators and peripheral logic directly from the FPGA fabric.
- Memory No embedded on-chip RAM (0 total RAM bits), enabling deterministic logic-only implementations or use of external memory where required.
- Power Single-core supply range of 1.425 V to 1.575 V; datasheet includes dedicated coverage of low-power modes and power management for energy-conscious designs.
- Package & Mounting 48‑VFQFN exposed pad (48‑QFN, 6×6 mm) surface-mount package for compact board layouts and thermal anchoring via exposed pad.
- Temperature & Grade Industrial-grade device with an operating temperature range of -40 °C to 100 °C for temperature-tolerant applications.
- Standards & Compliance RoHS compliant as supplied for regulatory and manufacturing compatibility.
Typical Applications
- Industrial Control Use the industrial temperature rating and 34 I/Os to implement sensor and actuator interfaces, machine control logic, or timing/sequencing functions.
- Embedded Logic / Glue Implement custom protocol bridging, glue logic, or peripheral aggregation using the 768 logic elements and 30,000 gates of programmable logic.
- Low-Power Designs Leverage the ProASIC3 nano fabric’s documented low-power modes to minimize idle and operational power in battery-aware or energy-sensitive systems.
Unique Advantages
- Deterministic, Flash-Based FPGA Fabric: Flash-based ProASIC3 nano architecture provides non-volatile configuration for stable, retained logic without external configuration memory.
- Compact, Thermally Friendly Package: 48‑VFQFN with exposed pad (6×6 mm) supports small form-factor designs with improved thermal dissipation for continuous operation.
- Industrial Operating Range: Rated from -40 °C to 100 °C, enabling deployment in temperature-challenging environments typical of industrial applications.
- Clear Power Envelope: Narrow core supply range (1.425 V to 1.575 V) and dedicated low-power mode documentation simplify power-supply design and system-level power management.
- RoHS Compliance: Conforms to RoHS requirements to support regulatory and manufacturing needs.
Why Choose A3PN030-Z1QNG48I?
The A3PN030-Z1QNG48I positions itself as a compact, industrial-grade ProASIC3 nano FPGA option for embedded designs that require retained configuration, moderate logic capacity, and a small footprint. With 768 logic elements, 34 I/Os, and a 48‑VFQFN exposed-pad package, it addresses applications that need reliable, low-power programmable logic in a thermally-conscious surface-mount form factor.
This device suits engineers seeking a deterministic, flash-configured FPGA backed by Microchip Technology’s ProASIC3 nano family documentation on fabric architecture and power modes, offering a pragmatic balance of integration, temperature tolerance, and design flexibility.
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