A3PN030-Z1QNG68I

The A3PN030-Z1QNG68I is a ProASIC3 nano Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for compact, surface-mount applications. It provides a moderate logic capacity with 768 logic elements (approximately 30,000 gates) and 49 general-purpose I/O for integrating control, glue logic, and peripheral interfaces.

Built and graded for industrial use, this device supports operation from -40 °C to 100 °C and accepts a core supply voltage between 1.425 V and 1.575 V. Its 68-VFQFN exposed-pad package (68-QFN, 8×8) targets space-constrained boards that require a small-footprint, surface-mount FPGA solution.

Key Features

• Core Logic 768 logic elements delivering approximately 30,000 gates of combinational and sequential logic capacity for low-to-moderate complexity designs.
• Memory Total on-chip RAM bits: 0 (no embedded RAM)
• I/O 49 I/O pins to support a variety of peripheral interfaces and board-level connectivity requirements.
• Power Core supply voltage range of 1.425 V to 1.575 V for predictable power-rail design and integration.
• Package & Mounting 68-VFQFN exposed-pad package; supplier device package listed as 68-QFN (8×8). Surface-mount mounting type suitable for compact PCB layouts.
• Temperature & Grade Industrial grade with an operating temperature range of -40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance RoHS compliant.

Typical Applications

• Industrial control — Implement control logic, protocol bridging, and deterministic I/O handling in industrial automation equipment where industrial-grade operation is required.
• Embedded system glue logic — Replace discrete logic with programmable fabric to consolidate glue logic and interface adaptation on compact boards using the 68-QFN footprint.
• Peripheral and I/O expansion — Provide additional programmable I/O and peripheral control for embedded and OEM products needing up to 49 general-purpose I/O pins.

Unique Advantages

• Right-sized logic capacity: 768 logic elements (≈30,000 gates) offer a balanced option for designs that require moderate amounts of programmable logic without excess resource overhead.
• Compact SMT package: 68-VFQFN exposed-pad in an 8×8 QFN footprint supports dense board layouts and standardized surface-mount assembly.
• Industrial temperature capability: Rated for -40 °C to 100 °C, enabling deployment in harsher ambient conditions commonly found in industrial applications.
• Predictable power integration: Defined core supply range (1.425 V–1.575 V) simplifies power-rail planning and component selection.
• Regulatory compliance: RoHS compliant for markets and products that require restriction of hazardous substances.

Why Choose A3PN030-Z1QNG68I?

The A3PN030-Z1QNG68I positions itself as a compact, industrial-grade FPGA option from Microchip Technology for designs that need moderate programmable logic, a sensible I/O count, and a small 68-QFN surface-mount package. Its specified operating temperature range and RoHS compliance make it suitable for industrial and embedded environments where component reliability and regulatory conformity matter.

This device is appropriate for engineers and OEMs looking to consolidate board-level logic, add peripheral interfacing, or implement control functions in a compact form factor while maintaining clearly defined power and thermal footprints.

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