A3PN020-QNG68I

The A3PN020-QNG68I is a ProASIC3 nano Field Programmable Gate Array (FPGA) from Microchip Technology supplied in a 68-VFQFN exposed pad surface-mount package. It provides a compact, industrial-grade FPGA option with 520 logic elements and approximately 20,000 gates for small to medium complexity logic implementations.

With 49 available I/O, a defined supply voltage range of 1.425 V to 1.575 V and an operating temperature range of -40°C to 100°C, this device targets industrial embedded designs that require deterministic logic resources in a compact QFN package.

Key Features

• Core Logic — 520 logic elements (reported as Number Of Labs Clbs: 520) providing about 20,000 gates for implementing custom logic and glue functions.
• I/O Resources — 49 general-purpose I/O pins to support peripheral interfacing and board-level connectivity.
• Memory — No on-chip RAM (Total Ram Bits: 0), suitable for designs that do not require embedded memory resources.
• Power Supply — Operates from 1.425 V to 1.575 V, enabling integration with low-voltage system rails.
• Package & Mounting — 68-VFQFN exposed pad package (supplier device package: 68-QFN, 8×8); surface-mount mounting type for compact PCB layouts and thermal conduction via exposed pad.
• Temperature & Grade — Industrial grade with an operating temperature range of -40°C to 100°C for deployment in industrial environments.
• Regulatory Status — RoHS compliant, supporting lead-free manufacturing requirements.

Typical Applications

• Industrial Control — Use the industrial-grade device for control logic, signal conditioning, and interfacing tasks where -40°C to 100°C operation and 49 I/O are required.
• Embedded Glue Logic — Implement glue logic, protocol bridging or small-scale state machines using the 520 logic elements and approximately 20,000 gates.
• Peripheral Interfacing — Provide custom I/O mapping and timing adjustments for sensors, actuators, or communication peripherals with the available I/O resources.

Unique Advantages

• Compact QFN Package: 68-VFQFN / 68-QFN (8×8) package with exposed pad enables a small PCB footprint and improved thermal path through the pad.
• Industrial Temperature Range: Rated from -40°C to 100°C to meet the needs of industrial deployments.
• Deterministic Logic Capacity: 520 logic elements and ~20,000 gates give predictable resource availability for defined design scopes.
• Low-Voltage Operation: Defined supply range of 1.425 V to 1.575 V to integrate with low-voltage system rails.
• RoHS Compliant: Conforms to RoHS requirements for lead-free assembly environments.

Why Choose A3PN020-QNG68I?

The A3PN020-QNG68I positions itself as a compact, industrial-grade FPGA option for designs that require a moderate number of logic elements, a fixed set of I/O, and a defined low-voltage supply. Its 68-VFQFN exposed pad package and surface-mount mounting make it suitable for space-constrained PCBs that also require a thermal conduction path.

This Microchip Technology device is appropriate for engineers designing embedded control, interfacing, or glue-logic functions where predictable logic resources, industrial temperature capability, and RoHS compliance are key selection criteria.

Request a quote or submit a request for pricing and availability for the A3PN020-QNG68I to proceed with procurement and design planning.