A3PN020-1QNG68I

The A3PN020-1QNG68I is a ProASIC3 nano field programmable gate array (FPGA) IC from Microchip Technology. It provides a compact, surface-mount FPGA option with 520 logic elements and approximately 20,000 gates in a 68‑lead VFQFN exposed-pad package.

Designed for industrial-grade embedded designs, this device suits applications that require a modest logic capacity with a fixed I/O count, a narrow core supply voltage range, and an extended operating temperature window.

Key Features

• Logic Capacity  Approximately 520 logic elements and 20,000 gates for implementing glue logic, state machines, and custom combinational/sequential functions.
• I/O and Connectivity  49 user I/O pins to support a variety of external interfaces and sensor or peripheral connections.
• Memory  No embedded on-chip RAM (total RAM bits: 0), enabling deterministic logic usage without internal data SRAM.
• Power  Core supply voltage specified from 1.425 V to 1.575 V, allowing precise power budgeting around a 1.5 V domain.
• Package and Mounting  68‑lead VFQFN with exposed pad (supplier device package: 68‑QFN, 8×8 mm) for compact, board-level integration and thermal conduction; surface-mount mounting type.
• Temperature and Grade  Industrial grade with an operating temperature range of −40°C to 100°C, suitable for temperature-demanding environments.
• Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control  Implement control logic and interface glue in factory automation and machine control systems that require industrial temperature operation and stable I/O counts.
• Embedded Logic Consolidation  Replace discrete glue components or small CPLDs with integrated logic functions using 520 logic elements and 49 I/Os to reduce BOM and PCB area.
• Sensor and Peripheral Interface  Aggregate and condition signals from sensors or peripherals where a fixed number of I/Os and deterministic logic are needed.

Unique Advantages

• Compact, thermally efficient package: The 68‑VFQFN exposed‑pad package (8×8 mm) enables tight board layouts while providing a thermal path through the exposed pad.
• Industrial temperature rating: Rated for −40°C to 100°C operation, allowing deployment in harsher environments without additional qualification steps.
• Defined logic capacity: 520 logic elements and 20,000 gates provide clear resources for designers to size implementations and estimate system partitioning.
• Fixed, predictable I/O count: 49 user I/Os simplify interface planning and connector/pin allocation for embedded systems.
• Regulatory readiness: RoHS compliance supports environmentally conscious manufacturing and sourcing requirements.
• Vendor-backed solution: Manufactured by Microchip Technology, offering a known supply source for production designs.

Why Choose A3PN020-1QNG68I?

The A3PN020-1QNG68I positions itself as a practical choice for industrial embedded designs that need a compact FPGA with defined logic density and a stable I/O count. Its industrial temperature range, small exposed‑pad VFQFN package, and RoHS compliance make it well suited for space-constrained boards and temperature-challenging deployments.

Designers and procurement teams looking for straightforward logic consolidation, reliable board-level integration, and a clear resource profile will find the A3PN020-1QNG68I aligned with those needs, backed by Microchip Technology as the manufacturer.

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