A3PN020-1QNG68

IC FPGA 49 I/O 68QFN
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad

Quantity 622 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package68-QFN (8x8)GradeCommercialOperating Temperature-20°C – 85°C
Package / Case68-VFQFN Exposed PadNumber of I/O49Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs520Number of Logic Elements/Cells520
Number of Gates20000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3PN020-1QNG68 – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 49 I/O, 68-VFQFN Exposed Pad

The A3PN020-1QNG68 is a ProASIC3 nano FPGA manufactured by Microchip Technology. It provides a programmable logic solution with approximately 20,000 gates implemented across 520 logic elements, and supports up to 49 user I/O pins.

Packaged in a compact 68-VFQFN with exposed pad and specified for surface-mount assembly, this commercial-grade device operates from 1.425 V to 1.575 V and across an operating temperature range of -20 °C to 85 °C, making it suitable for space-constrained, low-voltage digital designs.

Key Features

  • Logic Capacity  Approximately 20,000 gates implemented using 520 logic elements, enabling modest complexity programmable logic designs.
  • I/O Count  Up to 49 user I/O pins to interface with peripheral devices and system signals.
  • Memory  No on-chip RAM (Total Ram Bits: 0), suitable for designs that use external memory or do not require embedded RAM.
  • Power  Low-voltage core operation with a supply range of 1.425 V to 1.575 V for power-conscious designs.
  • Package & Mounting  68-VFQFN exposed pad (supplier package: 68-QFN, 8×8) in a surface-mount form factor for compact PCB layouts and thermal grounding via the exposed pad.
  • Temperature Range  Commercial operating range from -20 °C to 85 °C for typical commercial electronics environments.
  • Compliance  RoHS compliant.

Typical Applications

  • Compact digital logic  Implement glue logic, protocol translation, or control state machines where up to 49 I/O and ~20,000 gates meet system requirements.
  • Low-voltage system designs  Integrate programmable logic into systems that operate within the 1.425 V to 1.575 V core voltage window.
  • Space-constrained PCBs  Use the 68-VFQFN exposed pad package for dense board layouts and improved thermal contact in small form-factor designs.

Unique Advantages

  • Balanced logic density: 520 logic elements and ~20,000 gates provide a trade-off between capability and device footprint for many mid-range programmable tasks.
  • Compact package with thermal pad: The 68-VFQFN exposed pad reduces PCB area while offering a solderable thermal return for heat dissipation.
  • Low-voltage operation: Narrow supply range (1.425–1.575 V) supports power-optimized designs and predictable core behavior.
  • Commercial temperature suitability: Rated for -20 °C to 85 °C to meet typical commercial product environments.
  • RoHS compliant: Aligns with standard environmental and manufacturing requirements.

Why Choose A3PN020-1QNG68?

The A3PN020-1QNG68 offers a compact, low-voltage FPGA option with a clear set of capabilities—approximately 20,000 gates across 520 logic elements and up to 49 I/O—housed in a 68-VFQFN exposed pad package. Its specification set targets designers who need moderate programmable logic capacity with a small footprint and surface-mount package.

Backed by Microchip Technology, this commercial-grade device provides predictable operating ranges and RoHS compliance, making it a practical choice for teams focused on compact digital logic implementations and low-voltage system integration.

Request a quote or submit a pricing and availability inquiry for the A3PN020-1QNG68 to receive more information and support for your design and procurement needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1989


    Headquarters: Chandler, Arizona, USA


    Employees: 22,000+


    Revenue: $8.349 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D


    Featured Products
    Latest News
    keyboard_arrow_up