A3PN015-2QNG68

The A3PN015-2QNG68 is a ProASIC3 nano FPGA device offering a compact, surface-mount 68-VFQFN package with an exposed pad. It provides a low-voltage programmable logic solution with 384 logic elements and 49 I/O pins for commercial-grade embedded designs.

Intended for applications that require moderate gate density and flexible I/O in a small footprint, this device delivers a balance of integration and power efficiency through a narrow 1.425 V to 1.575 V supply window and an operating temperature range of -20 °C to 85 °C.

Key Features

• Logic Capacity  Approximately 384 logic elements and 15,000 gates for implementing glue logic, control state machines, and small custom digital functions.
• I/O Count  49 general-purpose I/O pins suitable for sensor interfaces, peripheral control, and protocol bridging in compact systems.
• Power  Designed for low-voltage systems with a supply range of 1.425 V to 1.575 V to match tight power-rail requirements.
• Package and Mounting  68-VFQFN package with exposed pad in a 68-QFN (8×8) supplier package footprint; surface-mount for dense PCB layouts and improved thermal contact.
• Temperature Grade  Commercial operating range from -20 °C to 85 °C for standard electronics and consumer applications.
• Compliance  RoHS-compliant design to meet common environmental and assembly requirements.
• Memory Architecture  This device is focused on logic and I/O capability (Total on‑chip RAM: 0 bits), providing deterministic resources for dedicated combinational and sequential logic tasks.

Typical Applications

• Embedded Control  Implement compact control logic and state machines for consumer and commercial products where a small programmable device is required.
• Protocol Bridging  Provide I/O buffering and simple protocol translation between peripherals and system controllers using available GPIO resources.
• User Interface Control  Drive and manage buttons, LEDs, and simple displays while offloading repetitive tasks from the main MCU.
• Sensor Interfacing  Aggregate and condition digital sensor signals with programmable logic and moderate I/O counts in space-constrained designs.

Unique Advantages

• Space-efficient package: The 68-VFQFN (8×8) exposed-pad footprint minimizes PCB area while supporting thermal dissipation through the pad.
• Right-sized logic density: Approximately 384 logic elements and 15,000 gates provide the capacity needed for glue logic and compact digital functions without excess overhead.
• Low-voltage compatibility: Tight supply range (1.425 V–1.575 V) aligns the device with modern low-voltage platforms and power domains.
• Commercial temperature suitability: Rated for -20 °C to 85 °C, matching common temperature requirements for business and consumer electronics.
• RoHS compliant: Ready for lead-free assembly flows and environmental compliance requirements.

Why Choose A3PN015-2QNG68?

The A3PN015-2QNG68 positions itself as a practical, compact FPGA option for commercial applications that need programmable logic and flexible I/O in a small, surface-mount package. Its combination of approximately 384 logic elements, 49 I/Os, and a low-voltage supply range makes it well suited for designers looking to implement deterministic digital functions, protocol adaptation, or control logic without a large form factor or high resource overhead.

For teams focused on reducing BOM complexity and optimizing PCB space, this device delivers a focused feature set backed by RoHS compliance and a package designed for effective thermal conduction via the exposed pad.

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