A3PN015-2QNG68I

IC FPGA 49 I/O 68QFN
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad

Quantity 1,101 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package68-QFN (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case68-VFQFN Exposed PadNumber of I/O49Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells384
Number of Gates15000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3PN015-2QNG68I – ProASIC3 nano FPGA, 49 I/O, 68‑VFQFN

The A3PN015-2QNG68I is a ProASIC3 nano Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a compact, industrial-grade programmable logic solution with 384 logic elements and approximately 15,000 gates in a 68‑VFQFN exposed‑pad package.

This device is specified for surface‑mount applications and is designed for deployments that require moderate logic density, 49 general‑purpose I/O, and low‑voltage core operation within an industrial temperature range.

Key Features

  • Core Logic 384 logic elements delivering roughly 15,000 gates for implementing moderate-complexity programmable logic and glue‑logic functions.
  • I/O Count 49 general‑purpose I/O pins suitable for interfacing with external peripherals and system signals.
  • Package 68‑VFQFN exposed pad (supplier device package: 68‑QFN, 8×8 mm) providing a compact footprint with an exposed pad for thermal management.
  • Power Core supply voltage range of 1.425 V to 1.575 V for low‑voltage system integration.
  • Temperature & Grade Industrial grade operation with an ambient operating temperature range of −40 °C to 100 °C.
  • Mounting & Compliance Surface‑mount device, RoHS compliant for lead‑free assembly processes.

Unique Advantages

  • Compact, manufacturable package: 68‑VFQFN exposed‑pad footprint (8×8 mm supplier QFN) enables small board area and reliable thermal dissipation for dense system designs.
  • Industrial temperature rating: Specified −40 °C to 100 °C operation supports deployments in harsh or wide‑temperature environments.
  • Moderate logic capacity: 384 logic elements and ~15,000 gates provide sufficient programmable resources for control, interface, and custom logic without excess overhead.
  • Low‑voltage core: Narrow supply range (1.425 V–1.575 V) facilitates integration into low‑voltage power domains common in modern embedded systems.
  • Surface‑mount readiness and RoHS compliance: Designed for standard surface‑mount manufacturing flows and compliant with RoHS requirements.

Why Choose A3PN015-2QNG68I?

The A3PN015-2QNG68I positions itself as a compact, industrial‑grade FPGA option from Microchip Technology for designs that need moderate programmable logic, a healthy complement of I/O, and a small QFN footprint. Its exposed‑pad package and industrial temperature rating make it suitable where board space and thermal considerations matter.

This device is well matched to engineers and procurement teams seeking a low‑voltage, RoHS‑compliant FPGA from an established manufacturer, offering straightforward integration into surface‑mount production flows and reliable operation across a wide temperature range.

Request a quote or submit an inquiry today to discuss availability and lead times for the A3PN015-2QNG68I.

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