A3PN015-1QNG68I

IC FPGA 49 I/O 68QFN
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad

Quantity 492 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package68-QFN (8x8)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case68-VFQFN Exposed PadNumber of I/O49Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs384Number of Logic Elements/Cells384
Number of Gates15000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A3PN015-1QNG68I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 49 I/O, 68‑VFQFN (Exposed Pad)

The A3PN015-1QNG68I is a ProASIC3 nano field programmable gate array (FPGA) in a 68‑lead VFQFN package with exposed pad. It provides a compact, industrial‑grade programmable logic solution with a defined logic capacity and I/O count for embedded designs.

With 384 logic elements (approximately 15,000 gates) and 49 user I/O, this device addresses applications requiring moderate programmable logic density, low‑voltage operation, and a wide operating temperature range for industrial environments.

Key Features

  • Core Logic  384 logic elements (reported) delivering about 15,000 gates of programmable logic capacity for implementing custom combinational and sequential logic.
  • I/O Density  49 user I/O pins to interface with external devices and peripherals in a compact package.
  • Memory  No on‑chip RAM bits are provided; designs should plan for external memory if required.
  • Power  Specified supply voltage range of 1.425 V to 1.575 V for core operation to match low‑voltage system rails.
  • Package  68‑lead VFQFN with exposed pad (supplier device package: 68‑QFN, 8×8 mm) optimized for surface mount assembly and thermal performance.
  • Operating Temperature & Grade  Industrial grade device rated from −40 °C to 100 °C for deployment in temperature‑sensitive industrial environments.
  • Mounting & Compliance  Surface mount package with RoHS compliance.

Unique Advantages

  • Compact, manufacturable package: The 68‑VFQFN exposed pad footprint supports high‑density PCB layouts and standard surface mount assembly.
  • Industrial temperature qualification: Specified −40 °C to 100 °C rating enables use in industrial environments where extended temperature range is required.
  • Moderate programmable logic capacity: 384 logic elements and ~15,000 gates provide a balance of functionality and cost for mid‑range logic tasks.
  • Low‑voltage core support: 1.425 V to 1.575 V supply range supports integration into low‑voltage systems and power‑sensitive designs.
  • RoHS compliant: Environmentally compliant manufacturing and supply chain compatibility.
  • Generous I/O count: 49 I/O pins enable multiple peripheral interfaces without requiring a larger package.

Why Choose A3PN015-1QNG68I?

The A3PN015-1QNG68I positions itself as a compact, industrial‑grade FPGA option for designs that need a defined amount of programmable logic, a substantial I/O count, and reliable operation across a wide temperature range. Its low‑voltage core and surface mount 68‑VFQFN package make it suitable for space‑constrained, production‑assembled boards.

This device is appropriate for engineers and procurement teams seeking a RoHS‑compliant, moderately capable FPGA with explicit specifications for logic elements, gate count, I/O, and operating conditions—offering predictable integration and long‑term deployment in industrial applications.

Request a quote or submit a procurement inquiry for the A3PN015-1QNG68I to receive pricing, availability, and lead‑time information tailored to your project needs.

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