A3PN015-1QNG68I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 49 68-VFQFN Exposed Pad |
|---|---|
| Quantity | 492 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 68-QFN (8x8) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 68-VFQFN Exposed Pad | Number of I/O | 49 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 384 | Number of Logic Elements/Cells | 384 | ||
| Number of Gates | 15000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A3PN015-1QNG68I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 49 I/O, 68‑VFQFN (Exposed Pad)
The A3PN015-1QNG68I is a ProASIC3 nano field programmable gate array (FPGA) in a 68‑lead VFQFN package with exposed pad. It provides a compact, industrial‑grade programmable logic solution with a defined logic capacity and I/O count for embedded designs.
With 384 logic elements (approximately 15,000 gates) and 49 user I/O, this device addresses applications requiring moderate programmable logic density, low‑voltage operation, and a wide operating temperature range for industrial environments.
Key Features
- Core Logic 384 logic elements (reported) delivering about 15,000 gates of programmable logic capacity for implementing custom combinational and sequential logic.
- I/O Density 49 user I/O pins to interface with external devices and peripherals in a compact package.
- Memory No on‑chip RAM bits are provided; designs should plan for external memory if required.
- Power Specified supply voltage range of 1.425 V to 1.575 V for core operation to match low‑voltage system rails.
- Package 68‑lead VFQFN with exposed pad (supplier device package: 68‑QFN, 8×8 mm) optimized for surface mount assembly and thermal performance.
- Operating Temperature & Grade Industrial grade device rated from −40 °C to 100 °C for deployment in temperature‑sensitive industrial environments.
- Mounting & Compliance Surface mount package with RoHS compliance.
Unique Advantages
- Compact, manufacturable package: The 68‑VFQFN exposed pad footprint supports high‑density PCB layouts and standard surface mount assembly.
- Industrial temperature qualification: Specified −40 °C to 100 °C rating enables use in industrial environments where extended temperature range is required.
- Moderate programmable logic capacity: 384 logic elements and ~15,000 gates provide a balance of functionality and cost for mid‑range logic tasks.
- Low‑voltage core support: 1.425 V to 1.575 V supply range supports integration into low‑voltage systems and power‑sensitive designs.
- RoHS compliant: Environmentally compliant manufacturing and supply chain compatibility.
- Generous I/O count: 49 I/O pins enable multiple peripheral interfaces without requiring a larger package.
Why Choose A3PN015-1QNG68I?
The A3PN015-1QNG68I positions itself as a compact, industrial‑grade FPGA option for designs that need a defined amount of programmable logic, a substantial I/O count, and reliable operation across a wide temperature range. Its low‑voltage core and surface mount 68‑VFQFN package make it suitable for space‑constrained, production‑assembled boards.
This device is appropriate for engineers and procurement teams seeking a RoHS‑compliant, moderately capable FPGA with explicit specifications for logic elements, gate count, I/O, and operating conditions—offering predictable integration and long‑term deployment in industrial applications.
Request a quote or submit a procurement inquiry for the A3PN015-1QNG68I to receive pricing, availability, and lead‑time information tailored to your project needs.

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