A3PN020-2QNG68I

The A3PN020-2QNG68I is a ProASIC3 nano field programmable gate array (FPGA) designed for industrial applications. It delivers a compact, low-voltage programmable-logic solution with 520 logic elements and approximately 20,000 gates, providing flexible digital integration for space- and power-conscious designs.

With 49 I/O pins, surface-mount 68-VFQFN package with exposed pad, and an industrial operating range, this device targets designs that require configurable logic in demanding temperature and board-layout environments.

Key Features

• Core Logic 520 logic elements and roughly 20,000 gates for implementing combinational and sequential logic functions.
• I/O Density 49 user I/O pins to support multiple interfaces and peripheral connections.
• Power Core supply voltage range of 1.425 V to 1.575 V for low-voltage systems.
• Memory Total on-chip RAM bits: 0, suitable for designs that offload or do not require embedded RAM.
• Package & Mounting 68-VFQFN exposed-pad package (supplier device package: 68-QFN, 8×8) optimized for surface-mount PCB assembly and board-level thermal conduction.
• Temperature Grade Industrial operating range from −40 °C to 100 °C for deployment in harsh environments.
• Compliance RoHS‑compliant material status for environmental and manufacturing consistency.

Typical Applications

• Industrial control systems — Use the device where industrial temperature range and configurable logic are required for control, sequencing, or interface tasks.
• Interface bridging — Implement custom protocol glue and I/O adaptation leveraging 49 available I/O pins and programmable logic.
• Compact embedded designs — Ideal for space-constrained PCBs that benefit from a 68-VFQFN exposed-pad surface-mount package and a low-voltage core.
• Signal conditioning and preprocessing — Deploy the FPGA to perform deterministic digital preprocessing where on-chip RAM is not required.

Unique Advantages

• Industrial temperature support: Operation from −40 °C to 100 °C enables reliable performance in demanding environments.
• Compact, thermally effective package: 68-VFQFN with exposed pad (8×8 QFN) reduces PCB area while improving board-level heat dissipation.
• Low-voltage core: Narrow 1.425 V to 1.575 V supply window simplifies power-domain design for modern low-voltage systems.
• Predictable logic capacity: 520 logic elements and ~20,000 gates provide clear resource planning for mid-scale programmable logic requirements.
• RoHS compliance: Conforms to environmental manufacturing requirements for many global production programs.

Why Choose A3PN020-2QNG68I?

The A3PN020-2QNG68I positions itself as a compact, industrial-grade FPGA option for designers who need deterministic programmable logic capacity, moderate I/O counts, and a low-voltage core in a space-efficient package. Its 520 logic elements and ~20,000 gates make it well suited to mid-scale logic functions without on-chip RAM, while the 68‑VFQFN exposed-pad footprint supports thermal management in tightly packed boards.

This part is a practical choice for engineering teams building industrial controls, interface logic, or compact embedded systems that require clear resource sizing, RoHS compliance, and extended temperature operation.

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