A3PN250-Z1VQ100I

The A3PN250-Z1VQ100I is a ProASIC3 nano FPGA from Microchip Technology implementing the ProASIC3 nano FPGA fabric. It provides a mid-range programmable logic resource set with 6,144 logic elements, approximately 36.9 kbits of embedded RAM, and 68 user I/O pins in a 100-pin TQFP surface-mount package.

Designed for applications that require industrial-grade temperature performance and low-voltage operation, the device supports a core supply range of 1.425 V to 1.575 V and an operating temperature range of −40 °C to 100 °C. The accompanying ProASIC3 nano FPGA Fabric User’s Guide documents device architecture and low-power mode behavior.

Key Features

• Core Logic 6,144 logic elements (logic element cells) delivering up to 250,000 equivalent gates for implementable combinational and sequential logic.
• Embedded Memory Total on-chip RAM: 36,864 bits (approximately 0.0369 Mbits) for small buffers, state storage, and FIFOs.
• I/O Count 68 user I/O pins to support a variety of external interfaces and peripherals in a compact package.
• Power and Low-Power Support Core supply voltage range of 1.425 V to 1.575 V. The product family documentation includes dedicated coverage of low-power modes and power management.
• Package and Mounting 100-TQFP (100-VQFP, 14 × 14 mm supplier package); surface-mount mounting for compact PCB implementations.
• Operating Conditions Industrial-grade operating temperature from −40 °C to 100 °C suitable for a wide range of temperature-demanding environments.
• Compliance RoHS-compliant construction for regulatory alignment with restricted substance directives.

Typical Applications

• Industrial Control and Automation — Leverages the industrial temperature rating and 68 I/Os for sensor interfacing, discrete control logic, and system glue functions.
• Embedded Logic and Glue — Uses the 6,144 logic elements and 250k-gate capacity to implement custom protocol conversion, address decoding, or peripheral aggregation.
• Low-Power FPGA Designs — Suitable where low-voltage core operation and documented low-power modes are required to manage board-level power consumption.

Unique Advantages

• Balanced Logic Density: 6,144 logic elements and an equivalent of 250,000 gates provide a mid-range capacity for complex glue logic and moderate FPGA designs without overprovisioning.
• Compact, Surface-Mount Package: 100-TQFP package enables PCB-space-efficient integration while preserving a generous I/O count for external connectivity.
• Industrial Temperature Capability: Rated for −40 °C to 100 °C to support deployments in temperature-challenging environments.
• On-Chip RAM for Local Storage: 36,864 bits of embedded RAM for small buffering, state machines, and temporary data storage close to logic.
• Low-Voltage Core Operation: Narrow core supply range (1.425 V to 1.575 V) supports designs targeting low-voltage power domains.
• Regulatory Alignment: RoHS compliance assists with materials and environmental requirements for global product shipments.

Why Choose A3PN250-Z1VQ100I?

The A3PN250-Z1VQ100I combines a ProASIC3 nano FPGA fabric with a practical balance of logic elements, embedded RAM, and I/O density in a 100-pin TQFP package. Its industrial temperature rating and documented low-power modes make it a reliable option for designs that require robust operation across wide temperature ranges and controlled power budgets.

Engineers specifying this device benefit from a focused set of programmable resources—6,144 logic elements, 36,864 bits of on-chip RAM, 68 I/Os, and a compact surface-mount package—making it suitable for mid-range embedded logic, interface bridging, and industrial control tasks where predictable, verifiable specifications matter.

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