A3PN250-Z1VQG100I
| Part Description |
ProASIC3 nano Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP |
|---|---|
| Quantity | 2 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-VQFP (14x14) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 100-TQFP | Number of I/O | 68 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Unknown | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 6144 | Number of Logic Elements/Cells | 6144 | ||
| Number of Gates | 250000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 36864 |
Overview of A3PN250-Z1VQG100I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 68 I/Os, 100-TQFP
The A3PN250-Z1VQG100I is a ProASIC3 nano FPGA from Microchip Technology that delivers configurable programmable logic in a compact 100-pin TQFP package. Its architecture provides a balance of logic density, embedded memory, and I/O capacity suited for industrial embedded designs requiring adaptable digital logic.
This device targets applications that need on-board programmable logic, deterministic I/O, and defined low-power behavior, while operating from a narrow core voltage range and across an industrial temperature window.
Key Features
- Core Logic 6,144 logic elements (logic cells) providing a total of 250,000 gates of user-configurable logic capacity.
- Embedded Memory Approximately 36.9 kbits of on-chip RAM (36,864 total RAM bits) for small data buffering and state storage.
- I/O and Package 68 user I/Os in a compact surface-mount footprint; device is supplied in a 100-TQFP package (supplier device package: 100-VQFP, 14×14 mm).
- Power and Voltage Core supply range of 1.425 V to 1.575 V to support the device’s low-voltage operation model.
- Low-Power Modes (documented) The ProASIC3 nano family documentation describes multiple low-power modes including Static (Idle), User Low Static, Sleep and Shutdown modes for power-managed designs.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C, suitable for industrial temperature environments.
- Mounting and Compliance Surface-mount PCB assembly and RoHS-compliant manufacturing.
Typical Applications
- Embedded Logic Acceleration Implement custom state machines, protocol handling, and glue logic using 6,144 logic elements and abundant gate capacity.
- I/O Expansion and Signal Conditioning Use the 68 I/Os to interface and multiplex between sensors, peripherals, or legacy interfaces in space-constrained boards.
- Low-Power Control and Power Management Leverage documented low-power modes together with the defined core voltage range for energy-conscious control circuitry.
Unique Advantages
- Compact, high-density logic: 6,144 logic elements and 250,000 gates provide substantial programmable capacity in a 100-pin package, reducing board-level complexity.
- On-chip RAM for control tasks: Approximately 36.9 kbits of embedded memory supports buffering, small FIFOs, and state retention without external RAM.
- Defined low-voltage operation: Narrow core supply window (1.425–1.575 V) simplifies power-supply design and voltage regulation planning.
- Industrial temperature range: −40°C to 100°C rating supports deployment in industrial environments where temperature resilience is required.
- Surface-mount 100-TQFP package: Provides a standardized, compact footprint for automated PCB assembly and cost-effective manufacturing.
- RoHS-compliant: Meets environmental compliance requirements for modern electronics production.
Why Choose A3PN250-Z1VQG100I?
The A3PN250-Z1VQG100I positions itself as a versatile, industrial-grade programmable logic device that combines a clear logic element count, measurable gate capacity, and on-chip RAM in a compact TQFP package. Its documented low-power modes, defined core voltage range, and extended temperature rating make it suitable for embedded systems that require predictable behavior and footprint-efficient integration.
This device is well suited to engineers and procurement teams designing industrial control, I/O-heavy embedded systems, or compact programmable subsystems where a balance of logic density, I/O capability, and manufacturability is needed.
Request a quote or submit a pricing inquiry to learn about availability and lead times for the A3PN250-Z1VQG100I.

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