A3PN250-Z1VQG100I

IC FPGA 68 I/O 100VQFP
Part Description

ProASIC3 nano Field Programmable Gate Array (FPGA) IC 68 36864 100-TQFP

Quantity 2 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-VQFP (14x14)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case100-TQFPNumber of I/O68Voltage1.425 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs6144Number of Logic Elements/Cells6144
Number of Gates250000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits36864

Overview of A3PN250-Z1VQG100I – ProASIC3 nano Field Programmable Gate Array (FPGA) IC, 68 I/Os, 100-TQFP

The A3PN250-Z1VQG100I is a ProASIC3 nano FPGA from Microchip Technology that delivers configurable programmable logic in a compact 100-pin TQFP package. Its architecture provides a balance of logic density, embedded memory, and I/O capacity suited for industrial embedded designs requiring adaptable digital logic.

This device targets applications that need on-board programmable logic, deterministic I/O, and defined low-power behavior, while operating from a narrow core voltage range and across an industrial temperature window.

Key Features

  • Core Logic  6,144 logic elements (logic cells) providing a total of 250,000 gates of user-configurable logic capacity.
  • Embedded Memory  Approximately 36.9 kbits of on-chip RAM (36,864 total RAM bits) for small data buffering and state storage.
  • I/O and Package  68 user I/Os in a compact surface-mount footprint; device is supplied in a 100-TQFP package (supplier device package: 100-VQFP, 14×14 mm).
  • Power and Voltage  Core supply range of 1.425 V to 1.575 V to support the device’s low-voltage operation model.
  • Low-Power Modes (documented)  The ProASIC3 nano family documentation describes multiple low-power modes including Static (Idle), User Low Static, Sleep and Shutdown modes for power-managed designs.
  • Industrial Temperature Grade  Rated for operation from −40°C to 100°C, suitable for industrial temperature environments.
  • Mounting and Compliance  Surface-mount PCB assembly and RoHS-compliant manufacturing.

Typical Applications

  • Embedded Logic Acceleration  Implement custom state machines, protocol handling, and glue logic using 6,144 logic elements and abundant gate capacity.
  • I/O Expansion and Signal Conditioning  Use the 68 I/Os to interface and multiplex between sensors, peripherals, or legacy interfaces in space-constrained boards.
  • Low-Power Control and Power Management  Leverage documented low-power modes together with the defined core voltage range for energy-conscious control circuitry.

Unique Advantages

  • Compact, high-density logic: 6,144 logic elements and 250,000 gates provide substantial programmable capacity in a 100-pin package, reducing board-level complexity.
  • On-chip RAM for control tasks: Approximately 36.9 kbits of embedded memory supports buffering, small FIFOs, and state retention without external RAM.
  • Defined low-voltage operation: Narrow core supply window (1.425–1.575 V) simplifies power-supply design and voltage regulation planning.
  • Industrial temperature range: −40°C to 100°C rating supports deployment in industrial environments where temperature resilience is required.
  • Surface-mount 100-TQFP package: Provides a standardized, compact footprint for automated PCB assembly and cost-effective manufacturing.
  • RoHS-compliant: Meets environmental compliance requirements for modern electronics production.

Why Choose A3PN250-Z1VQG100I?

The A3PN250-Z1VQG100I positions itself as a versatile, industrial-grade programmable logic device that combines a clear logic element count, measurable gate capacity, and on-chip RAM in a compact TQFP package. Its documented low-power modes, defined core voltage range, and extended temperature rating make it suitable for embedded systems that require predictable behavior and footprint-efficient integration.

This device is well suited to engineers and procurement teams designing industrial control, I/O-heavy embedded systems, or compact programmable subsystems where a balance of logic density, I/O capability, and manufacturability is needed.

Request a quote or submit a pricing inquiry to learn about availability and lead times for the A3PN250-Z1VQG100I.

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