A54SX08-2FGG144I
| Part Description |
SX Field Programmable Gate Array (FPGA) IC 111 144-LBGA |
|---|---|
| Quantity | 1,006 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 52 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 111 | Voltage | 3 V - 5.5 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 768 | Number of Logic Elements/Cells | 768 | ||
| Number of Gates | 12000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX08-2FGG144I – SX Field Programmable Gate Array (FPGA) IC 111 144-LBGA
The A54SX08-2FGG144I is an SX-A family nonvolatile FPGA offered in a 144-pin fine-pitch BGA package. It provides 12,000 system gates and 768 logic elements, together with 111 user I/O pins and configurable multi‑voltage I/O support for mixed-voltage designs.
Designed for industrial temperature operation (‑40°C to 85°C) and RoHS-compliant packaging, this device targets system glue logic, I/O interfacing and in‑system programmable designs that require deterministic timing, secure configuration and hot-swap capable I/Os.
Key Features
- Logic Capacity — 12,000 system gates and 768 logic elements to implement control logic, glue logic and medium-density FPGA functions.
- Performance — Documented family performance up to 250 MHz system performance and 350 MHz internal performance for timing-critical paths.
- Flexible I/O — 111 user I/O pins with configurable I/O support for 3.3 V/5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; supports mixed-voltage operation and 5 V input tolerance/drive.
- Nonvolatile Single-Chip Configuration — On-chip nonvolatile configuration removes the need for external configuration PROMs and supports fast, deterministic startup.
- Power and Hot-Swap Friendly — Power-up/power-down friendly behavior with no required sequencing and Hot-Swap compliant I/Os for board-level hot insertion scenarios.
- Security — Secure programming capability with FuseLock technology to protect bitstreams from reverse engineering and unauthorized readback.
- Package and Mounting — Delivered in a 144-LBGA (144-FPBGA, 13×13) surface-mount package suitable for compact board designs; supplier device package listed as 144-FPBGA (13×13).
- Electrical and Environmental — Operates from 3 V to 5.5 V and rated for industrial temperature range (‑40°C to 85°C); RoHS-compliant.
- Test and Debug Support — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic capabilities referenced in the family documentation.
Typical Applications
- PCI and legacy interface bridging — 66 MHz PCI compliance and flexible I/O voltage support make the device suited for interface translation and peripheral bridging tasks.
- Industrial control and automation — Industrial temperature rating (‑40°C to 85°C) and robust I/O options support control logic, sensor interfacing and factory automation modules.
- In-system programmable logic — Nonvolatile single-chip configuration and secure programming enable reprogrammable logic in deployed systems without external configuration memory.
- Production test and boundary-scan — IEEE 1149.1 boundary-scan support aids manufacturing test and board-level debug workflows.
Unique Advantages
- Deterministic timing capability — Family performance and architecture provide clear timing behavior for predictable system performance.
- Reduced BOM and board complexity — Nonvolatile, single-chip configuration removes the need for separate configuration PROMs and simplifies power sequencing requirements.
- Mixed-voltage system support — Configurable I/Os and 5 V tolerance allow seamless interfacing across legacy and modern logic levels without additional level-shifters.
- Secure field programmability — FuseLock-based programming protects intellectual property and prevents unauthorized design extraction.
- Industrial-grade operation — Rated for industrial temperature range and surface-mount 144-LBGA packaging for use in rugged environments.
Why Choose A54SX08-2FGG144I?
The A54SX08-2FGG144I delivers a balanced combination of medium-density logic (12,000 system gates, 768 logic elements), flexible multi-voltage I/O and nonvolatile in-system programmability in a compact 144-LBGA package. Its hot-swap capable I/Os, secure FuseLock programming and RoHS-compliant packaging make it a practical choice for industrial applications, interface bridging and embedded systems that require deterministic timing and field reconfigurability.
This device is well-suited for engineers seeking a secure, single-chip FPGA solution that reduces external components while supporting mixed-voltage system integration and industrial temperature operation.
Request a quote or submit an inquiry to get current pricing and availability for the A54SX08-2FGG144I and to discuss how it fits your design requirements.

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