A54SX08-2FGG144I

IC FPGA 111 I/O 144FBGA
Part Description

SX Field Programmable Gate Array (FPGA) IC 111 144-LBGA

Quantity 1,006 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LBGANumber of I/O111Voltage3 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs768Number of Logic Elements/Cells768
Number of Gates12000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX08-2FGG144I – SX Field Programmable Gate Array (FPGA) IC 111 144-LBGA

The A54SX08-2FGG144I is an SX-A family nonvolatile FPGA offered in a 144-pin fine-pitch BGA package. It provides 12,000 system gates and 768 logic elements, together with 111 user I/O pins and configurable multi‑voltage I/O support for mixed-voltage designs.

Designed for industrial temperature operation (‑40°C to 85°C) and RoHS-compliant packaging, this device targets system glue logic, I/O interfacing and in‑system programmable designs that require deterministic timing, secure configuration and hot-swap capable I/Os.

Key Features

  • Logic Capacity — 12,000 system gates and 768 logic elements to implement control logic, glue logic and medium-density FPGA functions.
  • Performance — Documented family performance up to 250 MHz system performance and 350 MHz internal performance for timing-critical paths.
  • Flexible I/O — 111 user I/O pins with configurable I/O support for 3.3 V/5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; supports mixed-voltage operation and 5 V input tolerance/drive.
  • Nonvolatile Single-Chip Configuration — On-chip nonvolatile configuration removes the need for external configuration PROMs and supports fast, deterministic startup.
  • Power and Hot-Swap Friendly — Power-up/power-down friendly behavior with no required sequencing and Hot-Swap compliant I/Os for board-level hot insertion scenarios.
  • Security — Secure programming capability with FuseLock technology to protect bitstreams from reverse engineering and unauthorized readback.
  • Package and Mounting — Delivered in a 144-LBGA (144-FPBGA, 13×13) surface-mount package suitable for compact board designs; supplier device package listed as 144-FPBGA (13×13).
  • Electrical and Environmental — Operates from 3 V to 5.5 V and rated for industrial temperature range (‑40°C to 85°C); RoHS-compliant.
  • Test and Debug Support — Boundary-scan testing compliant with IEEE 1149.1 (JTAG) and in-system diagnostic capabilities referenced in the family documentation.

Typical Applications

  • PCI and legacy interface bridging — 66 MHz PCI compliance and flexible I/O voltage support make the device suited for interface translation and peripheral bridging tasks.
  • Industrial control and automation — Industrial temperature rating (‑40°C to 85°C) and robust I/O options support control logic, sensor interfacing and factory automation modules.
  • In-system programmable logic — Nonvolatile single-chip configuration and secure programming enable reprogrammable logic in deployed systems without external configuration memory.
  • Production test and boundary-scan — IEEE 1149.1 boundary-scan support aids manufacturing test and board-level debug workflows.

Unique Advantages

  • Deterministic timing capability — Family performance and architecture provide clear timing behavior for predictable system performance.
  • Reduced BOM and board complexity — Nonvolatile, single-chip configuration removes the need for separate configuration PROMs and simplifies power sequencing requirements.
  • Mixed-voltage system support — Configurable I/Os and 5 V tolerance allow seamless interfacing across legacy and modern logic levels without additional level-shifters.
  • Secure field programmability — FuseLock-based programming protects intellectual property and prevents unauthorized design extraction.
  • Industrial-grade operation — Rated for industrial temperature range and surface-mount 144-LBGA packaging for use in rugged environments.

Why Choose A54SX08-2FGG144I?

The A54SX08-2FGG144I delivers a balanced combination of medium-density logic (12,000 system gates, 768 logic elements), flexible multi-voltage I/O and nonvolatile in-system programmability in a compact 144-LBGA package. Its hot-swap capable I/Os, secure FuseLock programming and RoHS-compliant packaging make it a practical choice for industrial applications, interface bridging and embedded systems that require deterministic timing and field reconfigurability.

This device is well-suited for engineers seeking a secure, single-chip FPGA solution that reduces external components while supporting mixed-voltage system integration and industrial temperature operation.

Request a quote or submit an inquiry to get current pricing and availability for the A54SX08-2FGG144I and to discuss how it fits your design requirements.

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