A54SX16A-TQG100I

The A54SX16A-TQG100I is an SX‑A family FPGA from Microchip Technology supplied in a 100‑pin thin quad flat pack (100‑LQFP / 100‑TQFP 14×14) surface‑mount package. This nonvolatile, single‑chip FPGA provides a midrange capacity device with approximately 24,000 system gates and 1,452 logic elements targeted at industrial embedded applications.

Designed for mixed‑voltage systems, hot‑swap and power sequencing‑sensitive environments, the device supports flexible I/O standards and deterministic timing features for control, interface and glue‑logic functions in industrial and embedded systems.

Key Features

• Core Capacity — Approximately 24,000 system gates and 1,452 logic elements for implementing midrange FPGA designs.
• Performance — SX‑A family performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance as specified for the family.
• I/O & Interface Flexibility — 81 user‑programmable I/O pins with configurable I/O support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; 5 V input tolerance and 5 V drive strength are supported at the family level.
• Voltage & Power — Operates from 2.25 V to 5.25 V supply range; devices are power‑up/down friendly and require no sequencing for supply voltages (family feature).
• Package & Mounting — Surface‑mount 100‑LQFP (supplier device package listed as 100‑TQFP 14×14) suitable for standard PCB assembly; industrial temperature grade.
• Industrial Temperature Grade — Rated for operation from −40 °C to +85 °C.
• Configuration & Security — Nonvolatile, single‑chip configuration and family‑level secure programming (FuseLock™) to help prevent reverse engineering and protect design IP.
• System Test & Diagnostics — Boundary‑scan testing compliant with IEEE 1149.1 (JTAG) and in‑system diagnostic/verification capability with Silicon Explorer II (family feature).
• I/O Control — Hot‑swap compliant I/Os, configurable weak pull‑up/pull‑down at power‑up and individual output slew rate control (family capabilities).
• No Embedded SRAM — Total on‑chip RAM bits reported as 0, indicating the device does not contain embedded RAM blocks.
• RoHS Compliant — Device is RoHS compliant.

Typical Applications

• PCI and Legacy Interface Bridging — Family support for 66 MHz PCI and multiple I/O voltage standards makes the device suitable for glue logic and interface conversion in mixed‑voltage systems.
• Industrial Control Logic — Deterministic, user‑controllable timing and industrial temperature rating support control and sequencing functions in industrial equipment.
• In‑System Diagnostics & Verification — Boundary‑scan (IEEE 1149.1) and in‑system diagnostic features enable board‑level testing and verification during development and production.
• Hot‑Swap and Power‑Sequencing Sensitive Designs — Hot‑swap I/O compliance and power‑up/power‑down friendly behavior help integration into systems where supplies may be inserted or removed under power.

Unique Advantages

• Nonvolatile Single‑Chip Configuration: Eliminates the need for external configuration memory, simplifying BOM and reducing board-level components.
• Flexible Mixed‑Voltage I/O: Support for multiple I/O standards (2.5 V, 3.3 V, 5 V) and 5 V input tolerance help integrate the FPGA into diverse legacy and modern interfaces.
• Industrial‑Grade Operating Range: −40 °C to +85 °C operating temperature and surface‑mount 100‑pin package provide a robust footprint for industrial embedded designs.
• Design Security: Family security features (FuseLock™) protect programmed configurations and guard intellectual property.
• Testability & Diagnostics: IEEE 1149.1 boundary‑scan and Silicon Explorer II diagnostic support enable thorough in‑system testing and verification workflows.
• Predictable Timing Control: Deterministic, user‑controllable timing options support designs that require precise timing behavior.

Why Choose A54SX16A-TQG100I?

The A54SX16A‑TQG100I combines midrange gate capacity with a nonvolatile, single‑chip FPGA architecture and flexible mixed‑voltage I/O, making it a practical choice for embedded and industrial applications that require reliable configuration, in‑system diagnostics and predictable timing. Its 1,452 logic elements and approximately 24,000 system gates provide the resources needed for control, interface and glue‑logic functions without external configuration memory.

With industrial temperature operation, hot‑swap‑compliant I/Os and family‑level security and test features, this device is suited for engineers building industrial control systems, interface bridges, or production‑testable embedded designs where robustness and integration matter.

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