A54SX32-BG329I

The A54SX32-BG329I is an SX-A family FPGA in a 329-ball BGA package, offering a nonvolatile, single-chip FPGA solution for industrial designs. Built for mixed-voltage I/O and in-system programmability, this device provides a compact, reprogrammable platform with 2,880 logic elements (approx. 48,000 system gates) and up to 249 user I/Os for complex glue logic, bus interfacing and control functions.

Designed for industrial temperature operation (–40 °C to 85 °C) and RoHS-compliant packaging, the A54SX32-BG329I targets embedded and industrial systems that require deterministic timing, configurable I/O standards, and in-system verification capabilities.

Key Features

• Core Capacity — Approximately 48,000 system gates implemented as 2,880 logic elements, suitable for mid-density logic integration and custom control functions.
• I/O Density & Flexibility — Up to 249 user I/Os with configurable support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2; supports mixed-voltage operation and 5 V input tolerance.
• Performance — Series-level performance metrics include up to 250 MHz system performance and 350 MHz internal performance (as specified for the SX-A family).
• Nonvolatile, Single-Chip Solution — Single-chip, nonvolatile architecture provides in-system programmability without external configuration memory.
• Package & Mounting — 329-ball BGA (supplier device package: 329-PBGA, 31×31) in a surface-mount form factor optimized for compact board designs.
• Power & Voltage — Wide supply tolerance from 3 V to 5.5 V and power-up/power-down friendly operation (no sequencing required for supply voltages as described in the series datasheet).
• Industrial Temperature Grade — Rated for industrial operation between –40 °C and 85 °C.
• System Reliability & Test — Boundary-scan (IEEE 1149.1) for board-level testability and unique in-system diagnostic/verification capability with Silicon Explorer II.
• Security — Series-level Actel Secure Programming Technology with FuseLock™ to protect bitstream confidentiality and prevent reverse engineering.
• Regulatory — RoHS compliant packaging.

Typical Applications

• Industrial Control and Automation — Implement custom control logic, I/O aggregation and deterministic timing functions for factory automation and process control within the industrial temperature range.
• PCI and Bus Interface Logic — Support for 3.3 V/5 V PCI signaling and hot-swap compliant I/Os makes the device suitable for PCI-compliant interface logic and bridge functions.
• Mixed-Voltage I/O Systems — Use as programmable I/O adapters or protocol translators where 2.5 V, 3.3 V and 5 V mixed-voltage support and 5 V tolerance are required.
• In-System Programmable Glue Logic — Compact, nonvolatile FPGA for board-level glue logic, timing control, and configurable peripheral handling with in-system verification.

Unique Advantages

• High-density, deterministic logic: 2,880 logic elements (≈48,000 system gates) provide ample mid-range integration with predictable timing behavior.
• Flexible I/O standards: Configurable I/O supports multiple voltage standards and mixed-voltage operation to simplify interfacing with legacy and modern peripherals.
• Nonvolatile, single-chip architecture: Eliminates external configuration memory and simplifies board-level design and power sequencing.
• Industrial readiness: Specified for –40 °C to 85 °C operation and supplied in a compact 329-BBGA package for reliable deployment in industrial environments.
• Built-in test and security: Boundary-scan support and FuseLock secure programming reduce development risk and protect intellectual property.
• Broad supply tolerance: 3 V to 5.5 V supply range supports flexible power architectures and mixed-voltage systems.

Why Choose A54SX32-BG329I?

The A54SX32-BG329I provides a balanced mid-density FPGA option for industrial embedded systems that need a nonvolatile, in-system programmable device with flexible mixed-voltage I/O and a compact BGA footprint. With 2,880 logic elements, up to 249 user I/Os, and industrial temperature capability, it addresses applications requiring reliable glue logic, interface control and deterministic timing.

Backed by Microchip Technology’s SX-A family architecture, the device combines secure programming, boundary-scan testability and configurable I/O to reduce BOM complexity and streamline board-level integration for long-lived industrial deployments.

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