A54SX32-BGG329I

IC FPGA 249 I/O 329BGA
Part Description

SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 47 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case329-BBGANumber of I/O249Voltage3 V - 5.5 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32-BGG329I – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32-BGG329I is an SX-A family nonvolatile FPGA offered by Microchip Technology, delivered in a 329-ball BGA package for surface-mount assembly. It provides a mid-range logic capacity with deterministic timing and mixed-voltage I/O support, making it suitable for industrial embedded designs that require flexible I/O interfacing and in-system diagnostic capability.

Key on-chip resources include approximately 48,000 system gates, 2,880 logic elements, and 249 user-programmable I/Os. The device supports 2.5 V, 3.3 V and 5 V mixed-voltage operation and operates from a 3 V to 5.5 V supply across an industrial temperature range of −40 °C to 85 °C.

Key Features

  • Logic Capacity  Approximately 48,000 system gates and 2,880 logic elements provide mid-range programmable logic for a variety of embedded functions.
  • User I/O and Mixed‑Voltage Support  249 user-programmable I/Os with configurable I/O support for 5 V TTL, 3.3 V LVTTL, 2.5 V LVCMOS2 and 5 V-tolerant inputs; supports mixed-voltage operation and selectable drive strengths.
  • Nonvolatile, Single‑Chip Solution  FPGA stores configuration on-chip for single-chip nonvolatile operation, simplifying board-level flash or external configuration memory requirements.
  • Performance Characteristics  SX-A family performance characteristics documented up to 250 MHz system performance and up to 350 MHz internal performance in family datasheet material.
  • Power and I/O Robustness  Power-up/down friendly design (no sequencing required for supply voltages), hot-swap compliant I/Os, and configurable weak pull-up/pull-down on I/O at power-up.
  • System Test and Security  Supports IEEE 1149.1 boundary-scan testing (JTAG) and Actel Secure Programming Technology with FuseLock for protection of programmed designs.
  • Packaging and Environmental  329-ball PBGA package (31 × 31) for surface-mount PCB assembly; rated for industrial operating temperature (−40 °C to 85 °C) and RoHS compliant.
  • Supply Voltage Range  Operates from 3 V to 5.5 V supply, enabling integration into a variety of voltage domains.

Typical Applications

  • PCI and Legacy I/O Systems  Configurable I/O levels and 5 V-tolerant I/O make this device suitable for designs that require PCI or legacy 5 V interfacing.
  • Industrial Control and Automation  Industrial temperature rating and flexible I/O allow deployment in embedded controllers, machine interfaces, and sensor aggregation where mixed-voltage interfaces are needed.
  • Manufacturing Test and In-System Diagnostics  Boundary-scan (IEEE 1149.1) and on-chip diagnostic support enable production testability and in-field verification workflows.
  • Mixed‑Voltage Interfacing  Useful where level translation and interfacing between 2.5 V, 3.3 V and 5 V devices are required on the same board.

Unique Advantages

  • Flexible Mixed‑Voltage I/O: Configurable I/O standards and 5 V-tolerant inputs simplify board-level interfacing to a wide range of peripherals without external translators.
  • Nonvolatile Single‑Chip Architecture: Eliminates the need for external configuration memory, reducing BOM complexity and simplifying system startup.
  • Industrial Temperature Rating: Rated for −40 °C to 85 °C operation, supporting deployment in industrial environments.
  • Deterministic Timing and High Utilization: Family features include deterministic, user-controllable timing and support for high resource utilization to maximize implemented logic.
  • Security and Testability: FuseLock secure programming and IEEE 1149.1 boundary-scan support protect intellectual property and streamline production testing.
  • Surface‑Mount BGA Packaging: 329-ball PBGA (31 × 31) provides a compact, solderable package suitable for high-density boards.

Why Choose A54SX32-BGG329I?

The A54SX32-BGG329I combines mid-range programmable logic capacity with robust I/O flexibility and a nonvolatile single-chip architecture. Its 48k-system-gate capacity and 2,880 logic elements suit applications that require deterministic timing, mixed-voltage interfacing, and reliable in-system diagnostics in industrial temperature environments.

This device is appropriate for engineers designing industrial embedded systems, I/O-intensive controllers, and boards that benefit from on-chip configuration and secure programming. The combination of configurable I/O, boundary-scan support, and secure programming provides a practical balance of integration, testability, and deployment robustness.

Request a quote or submit an inquiry to check pricing and availability for the A54SX32-BGG329I and to discuss how it can meet your design requirements.

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