A54SX32-BGG329
| Part Description |
SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 1,277 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Commercial | Operating Temperature | 0°C – 70°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 3 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32-BGG329 – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA
The A54SX32-BGG329 is a commercial-grade SX family FPGA from Microchip Technology, delivered in a 329-ball PBGA surface-mount package. It provides a nonvolatile, single-chip FPGA solution with support for mixed-voltage I/O and deterministic timing, suitable for mid-range logic integration and system glue applications where 48,000 system gates and up to 249 user I/Os are required.
Designed for integration into commercial electronic systems, this device balances performance—family-level system performance up to 250 MHz and internal performance up to 350 MHz—with flexible I/O and power-up behavior for reliable operation across 3 V to 5.25 V supplies.
Key Features
- Core Capacity: Approximately 48,000 system gates implemented as 2,880 logic elements, enabling mid-range logic integration for glue logic, protocol bridging, and control functions.
- I/O Density and Flexibility: 249 user I/Os provided in the 329-ball PBGA package; configurable I/O supports 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2 signaling, with 5 V input tolerance and 5 V drive strength options noted in the family datasheet.
- Nonvolatile Single-Chip Solution: Nonvolatile configuration in a single device removes the need for external configuration memory and simplifies board-level BOM and startup sequencing.
- Performance: SX family performance targets include up to 250 MHz system-level operation and up to 350 MHz internal performance for timing-critical paths (family-level specification).
- Power and I/O Management: Hot-swap compliant I/Os and power-up/power-down friendly behavior (no supply sequencing required) help simplify system power management.
- Packaging and Mounting: 329-ball PBGA (329-BBGA / supplier package 329-PBGA 31×31) in a surface-mount form factor; RoHS compliant lead-free packaging option available.
- Commercial Temperature Grade: Rated for 0 °C to 70 °C operation to match commercial equipment requirements.
- Security and Test: Family-level features include Actel Secure Programming technology (FuseLock™) and IEEE 1149.1 boundary-scan (JTAG) support for secure programming and testability.
- On-Chip Memory: No embedded RAM bits are provided in this device variant (Total RAM Bits: 0), emphasizing logic and I/O resources.
Typical Applications
- PCI-based System Glue: Use as a bridge or interface logic device in PCI and legacy bus systems leveraging the SX family’s 66 MHz PCI compliance and mixed-voltage I/O support.
- Mixed-Voltage Interface and Legacy Integration: Ideal for designs that require 5 V tolerant I/O and simultaneous 2.5 V / 3.3 V / 5 V interfacing in commercial equipment.
- Mid-Range Logic Integration: Implement control, protocol translation, and glue logic where ~48,000 system gates and 249 I/Os meet functional density and pin-count needs.
- In-System Debug and Verification: Development and production environments benefiting from built-in boundary-scan (JTAG) and family-provided in-system diagnostic capabilities.
Unique Advantages
- Nonvolatile, Single-Chip Implementation: Eliminates external configuration memory, simplifying board design and reducing BOM complexity.
- Mixed-Voltage I/O Flexibility: Support for 2.5 V, 3.3 V and 5 V signaling plus 5 V tolerance allows straightforward interfacing with legacy and modern logic families.
- Hot-Swap and Power-Friendly I/Os: Hot-swap compliant I/Os and no required supply sequencing make the device easier to integrate into systems with complex power domains.
- Security and Testability: Secure programming (FuseLock™) and IEEE 1149.1 boundary-scan support help protect IP and simplify manufacturing test.
- Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 70 °C) and RoHS-compliant packaging support standard commercial product deployments and regulatory preferences.
- Proven Family Performance: Family-level published performance (up to 250 MHz system and 350 MHz internal) supports timing-critical functions without external accelerators.
Why Choose A54SX32-BGG329?
The A54SX32-BGG329 positions itself as a robust, nonvolatile FPGA choice for commercial designs needing mid-range logic capacity, extensive I/O, and flexible mixed-voltage interfacing. Its 48,000 system gates and 2,880 logic elements provide the density required for protocol bridging, control logic, and system glue, while family-level performance figures support demanding timing requirements.
Backed by Microchip Technology and the SX family feature set—including hot-swap I/Os, boundary-scan testability, and secure programming—this device is suitable for development and production environments where reliable configuration, testability, and flexible I/O are priorities.
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