A54SX32-BGG329

IC FPGA 249 I/O 329BGA
Part Description

SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 1,277 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case329-BBGANumber of I/O249Voltage3 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32-BGG329 – SX Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32-BGG329 is a commercial-grade SX family FPGA from Microchip Technology, delivered in a 329-ball PBGA surface-mount package. It provides a nonvolatile, single-chip FPGA solution with support for mixed-voltage I/O and deterministic timing, suitable for mid-range logic integration and system glue applications where 48,000 system gates and up to 249 user I/Os are required.

Designed for integration into commercial electronic systems, this device balances performance—family-level system performance up to 250 MHz and internal performance up to 350 MHz—with flexible I/O and power-up behavior for reliable operation across 3 V to 5.25 V supplies.

Key Features

  • Core Capacity: Approximately 48,000 system gates implemented as 2,880 logic elements, enabling mid-range logic integration for glue logic, protocol bridging, and control functions.
  • I/O Density and Flexibility: 249 user I/Os provided in the 329-ball PBGA package; configurable I/O supports 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2 signaling, with 5 V input tolerance and 5 V drive strength options noted in the family datasheet.
  • Nonvolatile Single-Chip Solution: Nonvolatile configuration in a single device removes the need for external configuration memory and simplifies board-level BOM and startup sequencing.
  • Performance: SX family performance targets include up to 250 MHz system-level operation and up to 350 MHz internal performance for timing-critical paths (family-level specification).
  • Power and I/O Management: Hot-swap compliant I/Os and power-up/power-down friendly behavior (no supply sequencing required) help simplify system power management.
  • Packaging and Mounting: 329-ball PBGA (329-BBGA / supplier package 329-PBGA 31×31) in a surface-mount form factor; RoHS compliant lead-free packaging option available.
  • Commercial Temperature Grade: Rated for 0 °C to 70 °C operation to match commercial equipment requirements.
  • Security and Test: Family-level features include Actel Secure Programming technology (FuseLock™) and IEEE 1149.1 boundary-scan (JTAG) support for secure programming and testability.
  • On-Chip Memory: No embedded RAM bits are provided in this device variant (Total RAM Bits: 0), emphasizing logic and I/O resources.

Typical Applications

  • PCI-based System Glue: Use as a bridge or interface logic device in PCI and legacy bus systems leveraging the SX family’s 66 MHz PCI compliance and mixed-voltage I/O support.
  • Mixed-Voltage Interface and Legacy Integration: Ideal for designs that require 5 V tolerant I/O and simultaneous 2.5 V / 3.3 V / 5 V interfacing in commercial equipment.
  • Mid-Range Logic Integration: Implement control, protocol translation, and glue logic where ~48,000 system gates and 249 I/Os meet functional density and pin-count needs.
  • In-System Debug and Verification: Development and production environments benefiting from built-in boundary-scan (JTAG) and family-provided in-system diagnostic capabilities.

Unique Advantages

  • Nonvolatile, Single-Chip Implementation: Eliminates external configuration memory, simplifying board design and reducing BOM complexity.
  • Mixed-Voltage I/O Flexibility: Support for 2.5 V, 3.3 V and 5 V signaling plus 5 V tolerance allows straightforward interfacing with legacy and modern logic families.
  • Hot-Swap and Power-Friendly I/Os: Hot-swap compliant I/Os and no required supply sequencing make the device easier to integrate into systems with complex power domains.
  • Security and Testability: Secure programming (FuseLock™) and IEEE 1149.1 boundary-scan support help protect IP and simplify manufacturing test.
  • Commercial Temperature and RoHS Compliance: Commercial operating range (0 °C to 70 °C) and RoHS-compliant packaging support standard commercial product deployments and regulatory preferences.
  • Proven Family Performance: Family-level published performance (up to 250 MHz system and 350 MHz internal) supports timing-critical functions without external accelerators.

Why Choose A54SX32-BGG329?

The A54SX32-BGG329 positions itself as a robust, nonvolatile FPGA choice for commercial designs needing mid-range logic capacity, extensive I/O, and flexible mixed-voltage interfacing. Its 48,000 system gates and 2,880 logic elements provide the density required for protocol bridging, control logic, and system glue, while family-level performance figures support demanding timing requirements.

Backed by Microchip Technology and the SX family feature set—including hot-swap I/Os, boundary-scan testability, and secure programming—this device is suitable for development and production environments where reliable configuration, testability, and flexible I/O are priorities.

Request a quote or submit an inquiry to receive pricing and availability information for the A54SX32-BGG329.

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