AGL1000V2-FG144I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 97 147456 24576 144-LBGA |
|---|---|
| Quantity | 1,830 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 144-FPBGA (13x13) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 144-LBGA | Number of I/O | 97 | Voltage | 1.14 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 24576 | Number of Logic Elements/Cells | 24576 | ||
| Number of Gates | 1000000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 147456 |
Overview of AGL1000V2-FG144I – IGLOO Field Programmable Gate Array (FPGA) IC, 97 I/Os, 24576 Logic Elements, 144-LBGA
The AGL1000V2-FG144I is an IGLOO family flash FPGA from Microchip Technology configured for industrial applications. It combines a low-power flash-based FPGA architecture with a compact 144-LBGA package and support for 97 user I/Os, making it suitable for embedded control, low-power systems, and industrial logic functions.
Built on the IGLOO low-power flash process, the device provides nonvolatile configuration storage, ultra-low power modes such as Flash*Freeze, and up to 1,000,000 system gates with 24,576 logic elements and approximately 147,456 bits of on-chip true dual-port SRAM.
Key Features
- Core and Logic — 24,576 logic elements supporting up to 1,000,000 system gates for medium-density FPGA designs.
- Embedded Memory — Approximately 147,456 bits of true dual-port SRAM for embedded data buffering and state retention.
- I/O and Voltage Flexibility — 97 user I/Os with support for mixed-voltage I/O standards; device-level I/O voltage support described in the IGLOO family documentation.
- Low-Power Operation — Flash*Freeze technology enables ultra-low power retention (as low as 5 μW) and Low Power Active modes (from 12 μW) while maintaining FPGA content and enabling rapid recovery.
- Nonvolatile Flash Configuration — Flash-based reprogrammable configuration that retains programmed design when powered off and supports instant-on operation.
- Performance — IGLOO family performance characteristics include up to 250 MHz system performance at 1.5 V and 160 MHz at 1.2 V as documented for the series.
- Security and In-System Programming — Series-level features include on-chip AES decryption for ISP and FlashLock designed to secure FPGA contents (per IGLOO family documentation).
- Package and Mounting — 144-LBGA (supplier package 144-FPBGA, 13 × 13 mm) surface-mount package suitable for compact boards.
- Industrial Temperature Range — Rated for operation from −40 °C to 85 °C.
- Supply Voltage — Core voltage support from 1.14 V to 1.575 V.
- RoHS Compliant — Device meets RoHS requirements.
Typical Applications
- Industrial Control — Implement deterministic control logic, I/O aggregation, and state machines that benefit from an industrial temperature range and compact BGA package.
- Battery-Powered and Low-Power Systems — Use Flash*Freeze and Low Power Active modes to minimize standby consumption while retaining configuration and state.
- Embedded System Glue Logic — Replace multiple discrete components with a single reprogrammable device for protocol bridging, timing adaptation, and custom logic functions.
- Secure In-System Programmable Designs — Leverage the IGLOO family’s flash-based configuration and series-level ISP/security features for designs requiring secured updates and nonvolatile configuration.
Unique Advantages
- Ultra-Low Power Retention: Flash*Freeze mode reduces standby energy to micro-watt levels, enabling minimal-power retention of SRAM and registers.
- Nonvolatile, Reprogrammable Configuration: Flash-based configuration retains the programmed design without external memory, simplifying power-up behavior and system design.
- Compact, Surface-Mount Package: 144-LBGA (13 × 13 mm) offers a small footprint for space-constrained assemblies while providing a high I/O count.
- Industrial Reliability: Specified operating range of −40 °C to 85 °C and surface-mount package suitable for industrial deployments.
- Balanced Logic and Memory Capacity: 24,576 logic elements and approximately 147,456 bits of embedded SRAM support a broad set of mid-range FPGA functions without external RAM.
- Flexible Power and I/O Options: Low core-voltage operation (1.14 V–1.575 V) combined with the IGLOO family’s mixed-voltage I/O capabilities enables integration into varied system power architectures.
Why Choose AGL1000V2-FG144I?
The AGL1000V2-FG144I delivers a balance of nonvolatile flash configuration, low-power standby and active modes, and mid-range logic and memory resources in a compact 144-LBGA package. Its industrial temperature rating and surface-mount packaging make it suitable for embedded control and industrial designs that require reprogrammability, secure in-system updates, and low standby consumption.
This device is well suited to developers and procurement teams building compact, low-power FPGA-based solutions who need a single-chip, reprogrammable platform with sustained on-chip memory and a significant I/O count.
Request a quote or submit a purchase inquiry for the AGL1000V2-FG144I to evaluate suitability for your next low-power industrial FPGA design.

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