AGL1000V2-FG144I

IC FPGA 97 I/O 144FBGA
Part Description

IGLOO Field Programmable Gate Array (FPGA) IC 97 147456 24576 144-LBGA

Quantity 1,830 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package144-FPBGA (13x13)GradeIndustrialOperating Temperature-40°C – 85°C
Package / Case144-LBGANumber of I/O97Voltage1.14 V - 1.575 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs24576Number of Logic Elements/Cells24576
Number of Gates1000000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits147456

Overview of AGL1000V2-FG144I – IGLOO Field Programmable Gate Array (FPGA) IC, 97 I/Os, 24576 Logic Elements, 144-LBGA

The AGL1000V2-FG144I is an IGLOO family flash FPGA from Microchip Technology configured for industrial applications. It combines a low-power flash-based FPGA architecture with a compact 144-LBGA package and support for 97 user I/Os, making it suitable for embedded control, low-power systems, and industrial logic functions.

Built on the IGLOO low-power flash process, the device provides nonvolatile configuration storage, ultra-low power modes such as Flash*Freeze, and up to 1,000,000 system gates with 24,576 logic elements and approximately 147,456 bits of on-chip true dual-port SRAM.

Key Features

  • Core and Logic — 24,576 logic elements supporting up to 1,000,000 system gates for medium-density FPGA designs.
  • Embedded Memory — Approximately 147,456 bits of true dual-port SRAM for embedded data buffering and state retention.
  • I/O and Voltage Flexibility — 97 user I/Os with support for mixed-voltage I/O standards; device-level I/O voltage support described in the IGLOO family documentation.
  • Low-Power Operation — Flash*Freeze technology enables ultra-low power retention (as low as 5 μW) and Low Power Active modes (from 12 μW) while maintaining FPGA content and enabling rapid recovery.
  • Nonvolatile Flash Configuration — Flash-based reprogrammable configuration that retains programmed design when powered off and supports instant-on operation.
  • Performance — IGLOO family performance characteristics include up to 250 MHz system performance at 1.5 V and 160 MHz at 1.2 V as documented for the series.
  • Security and In-System Programming — Series-level features include on-chip AES decryption for ISP and FlashLock designed to secure FPGA contents (per IGLOO family documentation).
  • Package and Mounting — 144-LBGA (supplier package 144-FPBGA, 13 × 13 mm) surface-mount package suitable for compact boards.
  • Industrial Temperature Range — Rated for operation from −40 °C to 85 °C.
  • Supply Voltage — Core voltage support from 1.14 V to 1.575 V.
  • RoHS Compliant — Device meets RoHS requirements.

Typical Applications

  • Industrial Control — Implement deterministic control logic, I/O aggregation, and state machines that benefit from an industrial temperature range and compact BGA package.
  • Battery-Powered and Low-Power Systems — Use Flash*Freeze and Low Power Active modes to minimize standby consumption while retaining configuration and state.
  • Embedded System Glue Logic — Replace multiple discrete components with a single reprogrammable device for protocol bridging, timing adaptation, and custom logic functions.
  • Secure In-System Programmable Designs — Leverage the IGLOO family’s flash-based configuration and series-level ISP/security features for designs requiring secured updates and nonvolatile configuration.

Unique Advantages

  • Ultra-Low Power Retention: Flash*Freeze mode reduces standby energy to micro-watt levels, enabling minimal-power retention of SRAM and registers.
  • Nonvolatile, Reprogrammable Configuration: Flash-based configuration retains the programmed design without external memory, simplifying power-up behavior and system design.
  • Compact, Surface-Mount Package: 144-LBGA (13 × 13 mm) offers a small footprint for space-constrained assemblies while providing a high I/O count.
  • Industrial Reliability: Specified operating range of −40 °C to 85 °C and surface-mount package suitable for industrial deployments.
  • Balanced Logic and Memory Capacity: 24,576 logic elements and approximately 147,456 bits of embedded SRAM support a broad set of mid-range FPGA functions without external RAM.
  • Flexible Power and I/O Options: Low core-voltage operation (1.14 V–1.575 V) combined with the IGLOO family’s mixed-voltage I/O capabilities enables integration into varied system power architectures.

Why Choose AGL1000V2-FG144I?

The AGL1000V2-FG144I delivers a balance of nonvolatile flash configuration, low-power standby and active modes, and mid-range logic and memory resources in a compact 144-LBGA package. Its industrial temperature rating and surface-mount packaging make it suitable for embedded control and industrial designs that require reprogrammability, secure in-system updates, and low standby consumption.

This device is well suited to developers and procurement teams building compact, low-power FPGA-based solutions who need a single-chip, reprogrammable platform with sustained on-chip memory and a significant I/O count.

Request a quote or submit a purchase inquiry for the AGL1000V2-FG144I to evaluate suitability for your next low-power industrial FPGA design.

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