AGL1000V2-CSG281I

The AGL1000V2-CSG281I is an IGLOO field programmable gate array (FPGA) IC from Microchip Technology configured in a 281-TFBGA package. It delivers 24,576 logic elements, approximately 147,456 bits of embedded memory, and a 215-pin I/O count to address mid-density embedded logic and interfacing needs.

Specified for industrial use, this surface-mount device supports a core supply range of 1.14–1.575 V and an operating temperature range of −40 °C to 85 °C, providing a compact, integrated solution for industrial and embedded system designs.

Key Features

• Core Logic 24,576 logic elements (25k logic elements) and 1,000,000 gates deliver mid-density programmable logic capacity for custom digital functions.
• Embedded Memory Approximately 0.147 Mbits (147,456 bits) of on-chip RAM to support buffering, state machines, and small data stores within the FPGA fabric.
• I/O Resources 215 I/O pins available for flexible interfacing with peripherals, sensors, and external logic domains.
• Power Core operating voltage range of 1.14–1.575 V to match low-voltage system rails and enable efficient power planning.
• Package and Mounting Supplied in a 281-TFBGA (CSBGA) surface-mount package, supplier device package listed as 281-CSP (10×10) for compact PCB integration.
• Industrial Temperature Grade Rated for operation from −40 °C to 85 °C to meet temperature requirements in industrial environments.
• RoHS Compliance RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control Implement custom control logic and state machines for factory automation and process control using the device's industrial temperature rating and robust I/O count.
• Embedded System Interfaces Bridge and aggregate signals between sensors, processors, and peripherals where mid-density logic and on-chip RAM are required.
• Communications and Protocol Bridging Implement custom protocol translators or I/O expanders leveraging the 215 available I/O pins.
• Low- to Mid-Complexity Custom Logic Suitable for designs needing up to 24,576 logic elements and on-chip memory for buffering and control tasks.

Unique Advantages

• Balanced Logic Capacity: Provides 24,576 logic elements and 1,000,000 gates for mid-density designs without excess complexity.
• Compact Package Integration: The 281-TFBGA (281-CSP, 10×10) package enables high-density PCB layouts while maintaining a substantial I/O count.
• Industrial Temperature Range: Rated from −40 °C to 85 °C to support deployment in industrial and other temperature-challenging environments.
• Flexible I/O Count: 215 I/O pins allow for broad interfacing options with sensors, actuators, and system peripherals.
• Low-Voltage Operation: Core voltage support from 1.14 V to 1.575 V enables integration into modern low-voltage power domains.
• Regulatory Compliance: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose AGL1000V2-CSG281I?

The AGL1000V2-CSG281I positions itself as a mid-density FPGA solution that combines a substantial number of logic elements, embedded RAM, and a large I/O count in a compact surface-mount BGA package. Its industrial temperature rating and low-voltage operation make it well suited for embedded and industrial control designs that require reliable, configurable logic close to the I/O.

Designers seeking a programmable, RoHS-compliant device for mid-complexity logic, protocol bridging, or interface consolidation will find the AGL1000V2-CSG281I offers a practical balance of capacity, integration, and environmental robustness.

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