AGL1000V2-FG256I

The AGL1000V2-FG256I is an IGLOO family flash-based FPGA from Microchip Technology, featuring reprogrammable flash architecture and low-power operation modes. This device provides a mid-to-high density programmable fabric with 24,576 logic elements, approximately 147,456 bits of embedded RAM, and 177 user I/Os in a compact 256-LBGA package.

Designed for industrial applications that require low power, in-system programmability, and robust I/O flexibility, the AGL1000V2-FG256I delivers a combination of integration and energy-efficient operation for embedded control, instrumentation, and industrial automation designs.

Key Features

• Logic Capacity  24,576 logic elements (cells) providing a programmable fabric suited for complex glue logic, control tasks, and mid-density processing functions.
• Embedded Memory  Approximately 0.144 Mbits (147,456 bits) of on-chip RAM to support buffers, FIFOs, and local data storage for embedded designs.
• System Gates  1,000,000 system gates for substantial integration of custom logic and peripheral functions on a single device.
• I/O Density and Flexibility  177 user I/Os to support multiple peripheral interfaces, sensor inputs, and mixed-signal front-end connections in multi-bank configurations.
• Low-Voltage Core  Core supply range of 1.14 V to 1.575 V enabling low-power system architectures and single-voltage operation options.
• Flash-Based Nonvolatile Configuration  Reprogrammable flash technology for instant-on behavior and retention of programmed design when power is removed.
• Power Management Features  Series-level low-power capabilities including ultra-low standby modes to reduce system power while retaining configuration and state.
• Package and Mounting  256-LBGA, supplier device package 256-FPBGA (17×17), surface-mount construction for compact board-level integration.
• Industrial Temperature Grade  Specified operating range from −40°C to 85°C for deployment in industrial environments.
• RoHS Compliant  Meets RoHS environmental requirements for lead-free manufacturing.

Typical Applications

• Industrial Control and Automation  Use the device for programmable logic, motion control glue logic, and I/O consolidation in industrial systems operating across −40°C to 85°C.
• Low-Power Embedded Systems  Leverage the flash-based instant-on operation and low-voltage core to minimize standby and active power in battery-assisted or energy-conscious designs.
• Instrumentation and Test Equipment  Employ on-chip RAM and abundant I/Os for data buffering, signal conditioning interfaces, and custom measurement logic.
• Secure In-System Programming  Take advantage of flash reprogrammability and series-level ISP/security capabilities for field updates and protected configuration storage.

Unique Advantages

• Reprogrammable Flash Configuration: Retains programmed design when powered off and enables in-system updates without external configuration memory, simplifying system architecture.
• Energy-Efficient Operation: Low core voltage range and series low-power modes reduce system power consumption for always-on and intermittent-duty applications.
• High Integration Density: Combines 24,576 logic elements, ~0.144 Mbits of RAM, and 1,000,000 system gates to enable consolidation of multiple functions into a single device.
• Robust I/O Count: 177 user I/Os provide design flexibility for interfacing to sensors, actuators, and communication peripherals without requiring additional glue logic.
• Industrial Reliability: Rated for −40°C to 85°C operation and delivered in a compact 256-LBGA package for reliable use in industrial environments.
• RoHS Compliance: Supports lead-free production processes and environmental compliance requirements.

Why Choose AGL1000V2-FG256I?

The AGL1000V2-FG256I positions itself as a versatile, mid-to-high density IGLOO flash FPGA tailored for industrial and embedded applications that require reprogrammability, low-power operation, and a high I/O count. Its combination of logic elements, embedded RAM, and one million system gates enables consolidation of control, interface, and processing functions onto a single surface-mount package.

Engineers designing industrial control systems, portable instrumentation, or low-power embedded platforms will find the device’s flash-based configuration, compact 256-LBGA footprint, and industrial temperature rating valuable for reducing BOM complexity and improving system-level integration and robustness.

Request a quote or submit an inquiry for the AGL1000V2-FG256I to evaluate fit for your next design and receive pricing and availability information tailored to your requirements.