AGL1000V2-FGG144I

The AGL1000V2-FGG144I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology supplied in a 144-LBGA surface-mount package. It provides 24,576 logic elements, approximately 147,456 bits of embedded RAM, and 97 device I/Os, delivering a compact programmable fabric for industrial embedded designs.

With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of -40 °C to 85 °C, the device targets industrial-grade applications that require field-programmable logic, on-chip memory, and a high I/O count in a small footprint.

Key Features

• Logic Capacity — 24,576 logic elements providing the programmable fabric for implementing custom digital functions and control logic.
• On‑Chip Memory — Approximately 0.147 Mbits (147,456 bits) of embedded RAM for state storage, buffering, and small data structures.
• I/O Count — 97 device I/Os to interface with peripherals, sensors, and external logic.
• Gate Equivalent — Approximately 1,000,000 gates for estimating integration density and design partitioning.
• Power Supply — Supports a core voltage range of 1.14 V to 1.575 V, allowing designers to match system power architecture requirements.
• Package & Mounting — 144-LBGA package (Supplier device package: 144-FPBGA, 13×13) in a surface-mount form factor for compact board layouts.
• Operating Temperature — Industrial temperature range from -40 °C to 85 °C for deployment in temperature-variable environments.
• Compliance — RoHS compliant, meeting common environmental regulatory requirements for lead-free assembly.

Typical Applications

• Industrial Control — Implement custom control logic, state machines, and I/O aggregation for factory automation and machine control systems.
• Embedded Systems — Provide programmable glue logic, peripheral interfacing, and custom processing blocks in compact embedded products.
• Sensor and Data Acquisition — Aggregate and preprocess sensor data using on-chip logic and RAM before handing off to host processors.
• Communications Endpoints — Implement protocol handling, framing, and custom interface logic where moderate logic capacity and multiple I/Os are required.

Unique Advantages

• Compact, High‑Density FPGA — 24,576 logic elements and ~147,456 bits of RAM in a 144-LBGA package enable substantial integration in a small footprint, reducing board area.
• Industrial Temperature Range — Rated for -40 °C to 85 °C, suitable for designs operating across a wide range of environmental conditions.
• Flexible I/O Count — 97 I/Os support multiple peripheral interfaces and direct connections to sensors and actuators without extensive external logic.
• Defined Power Envelope — Operates across a 1.14 V to 1.575 V supply window to align with common core-voltage domains.
• Surface-Mount LBGA Packaging — 144-LBGA / 144-FPBGA (13×13) package supports high-density PCB layouts and reliable solder attachment for production assembly.
• RoHS Compliant — Meets lead-free manufacturing requirements for global electronics production.

Why Choose AGL1000V2-FGG144I?

The AGL1000V2-FGG144I positions itself as a compact, industrial-grade FPGA option for designers who need a balance of logic capacity, on-chip RAM, and a substantial I/O count within a small LBGA package. Its defined voltage and temperature specifications make it suitable for embedded and industrial applications where predictable electrical and thermal behavior is required.

This device is appropriate for engineering teams developing control systems, sensor interfaces, or communication endpoints that benefit from field-programmable logic, on-board memory, and a high degree of I/O integration, while maintaining compliance with RoHS requirements.

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