AGL1000V2-FGG484

The AGL1000V2-FGG484 is an IGLOO field programmable gate array (FPGA) IC from Microchip Technology. It provides 24,576 logic elements, 147,456 bits of on-chip RAM and up to 300 I/O pins in a compact 484-ball BGA package.

Designed for commercial-grade applications, this device combines moderate logic density, embedded memory and a high I/O count with a 1.14 V to 1.575 V supply range and a 0 °C to 70 °C operating temperature window.

Key Features

• Logic Capacity 24,576 logic elements (cells) suitable for medium-complexity programmable logic implementations.
• Embedded Memory 147,456 bits of on-chip RAM to support buffering, state storage and small data structures within the FPGA fabric.
• I/O Count 300 available I/O pins to interface with multiple peripherals, buses and external devices.
• Gate Count Approximately 1,000,000 gates enabling a balance of logic resources for control, interface and data-path functions.
• Power Operates from a supply voltage range of 1.14 V to 1.575 V, allowing direct use in systems designed around those core voltages.
• Package & Mounting 484-ball FPBGA (23 × 23) package in a surface-mount form factor for compact board integration.
• Commercial Grade & Temperature Rated for commercial use with an operating temperature range of 0 °C to 70 °C.
• RoHS Compliance Device is RoHS compliant for environmental and regulatory alignment.

Typical Applications

• Commercial Embedded Systems — Implement control logic, protocol handling or custom peripherals where moderate logic capacity and a high I/O count are required.
• Interface Bridging and IO Expansion — Use available I/Os and embedded memory to create protocol translators, bus bridges or expand connectivity between subsystems.
• Prototyping and System Integration — Deploy as a programmable logic element in development platforms and integrated products that target commercial temperature ranges.

Unique Advantages

• High Logic Density: 24,576 logic elements provide sufficient capacity for medium-complexity designs without moving to much larger FPGA families.
• Integrated On-Chip RAM: 147,456 bits of embedded memory support local buffering and state retention, reducing external memory requirements.
• Generous I/O Count: 300 I/Os enable broad peripheral connectivity and flexible board-level partitioning.
• Compact BGA Package: 484-ball FPBGA (23×23) minimizes PCB footprint while supporting high pin counts for dense system designs.
• Commercial Temperature Rating: Specified 0 °C to 70 °C operation aligns with a wide range of business and consumer applications.
• RoHS Compliant: Meets lead-free and hazardous substance restrictions for regulatory compliance.

Why Choose AGL1000V2-FGG484?

The AGL1000V2-FGG484 positions itself as a commercially rated FPGA solution that balances logic capacity, embedded memory and I/O density in a compact 484-BGA package. Its 24,576 logic elements, 147,456 bits of on-chip RAM and 300 I/Os make it suitable for designers implementing medium-complexity programmable logic, interface functions and embedded system integration within a 0 °C to 70 °C operating range.

Manufactured by Microchip Technology and compliant with RoHS requirements, this device is aimed at teams needing a reliable, space-efficient FPGA option that fits within the specified voltage and temperature operating window.

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