AGL1000V2-FGG484I

The AGL1000V2-FGG484I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology. It provides a configurable logic fabric sized at 24,576 logic elements with approximately 0.15 Mbits of embedded memory and up to 300 I/O pins, packaged in a 484-ball BGA for surface-mount applications.

Designed for industrial-grade embedded systems, this device supports designs that require high logic density, significant I/O count, and operation across a broad industrial temperature range.

Key Features

• Logic Capacity  Provides 24,576 logic elements to implement complex state machines, custom logic blocks, and glue logic within a single device.
• On-Chip Memory  Includes 147,456 bits of total RAM — approximately 0.15 Mbits of embedded memory for buffering, FIFOs, and small data storage.
• I/O Density  Offers 300 I/O pins to support extensive peripheral connectivity and multi-channel interfaces.
• Gate Count  Approximately 1,000,000 gates to support sizable combinational and sequential logic implementations.
• Power Supply  Operates from a supply range of 1.14 V to 1.575 V, enabling integration into low-voltage system domains.
• Package & Mounting  Available in a 484-BGA (484-FPBGA, 23×23) surface-mount package that suits high-density PCB layouts.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C for deployment in industrial environments.
• Regulatory Compliance  RoHS compliant, supporting lead-free manufacturing processes.

Typical Applications

• Industrial Control  Programmable logic for control systems and automation where industrial temperature operation and robust I/O are required.
• Embedded Processing  Custom logic and interface glue in embedded systems that need moderate on-chip memory and a high count of configurable I/O.
• Communications & Networking  I/O-dense functions and protocol adaptation in networked equipment operating in industrial settings.

Unique Advantages

• Substantial Logic Density: 24,576 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level complexity.
• Compact High-Density Package: 484-BGA (23×23) footprint provides a high pin count in a compact surface-mount form factor for space-constrained designs.
• Wide Operating Temperature: Rated from −40 °C to 85 °C to meet industrial environmental requirements without additional thermal derating.
• Broad I/O Support: 300 I/O pins allow flexible interfacing to sensors, peripherals, and external memory or logic devices.
• Low-Voltage Operation: 1.14 V to 1.575 V supply range supports integration into modern low-voltage systems.
• Regulatory Ready: RoHS compliance simplifies adoption in lead-free manufacturing workflows.

Why Choose AGL1000V2-FGG484I?

The AGL1000V2-FGG484I positions itself as an industrial-grade FPGA option that balances significant logic capacity, meaningful on-chip memory, and a high I/O count in a compact 484-BGA package. Its supported voltage range and industrial temperature rating make it suitable for embedded systems requiring reliable, configurable logic under demanding environmental conditions.

Engineers and procurement teams looking for a Microchip Technology IGLOO FPGA with robust I/O, consolidated logic capability, and RoHS compliance will find this part appropriate for medium-to-high density custom logic implementations in industrial applications.

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