AGL1000V2-FGG256I

The AGL1000V2-FGG256I is an IGLOO Field Programmable Gate Array (FPGA) IC designed for industrial-grade embedded logic implementations. It provides 24,576 logic elements, approximately 0.15 Mbits of on-chip RAM, and a rich set of I/O in a compact BGA package.

With a supply voltage range of 1.14 V to 1.575 V and an operating temperature range of −40 °C to 85 °C, this device targets industrial applications that require moderate logic density, significant I/O count, and RoHS-compliant surface-mount packaging.

Key Features

• Core Logic 24,576 logic elements providing the equivalent of 1,000,000 gates for custom combinational and sequential logic functions.
• Embedded Memory Approximately 0.15 Mbits of on-chip RAM (147,456 total RAM bits) for buffering, state storage, and small-data processing tasks.
• I/O Capability 177 general-purpose I/O pins to support a variety of external interfaces and peripheral connectivity.
• Power Operates from a 1.14 V to 1.575 V supply range to match system power domains and low-voltage logic levels.
• Package & Mounting 256-LBGA package; supplier device package listed as 256-FPBGA (17×17). Surface-mount mounting type for PCB assembly compatibility.
• Temperature & Grade Industrial-grade device rated for operation from −40 °C to 85 °C, suitable for a wide range of industrial environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial Control Implements custom control logic and I/O aggregation for factory automation or process-control equipment operating in industrial temperature ranges.
• Embedded Systems Provides programmable logic and on-chip RAM for mid-density embedded designs where a mix of logic, state machine control, and I/O is required.
• Interface Bridging Acts as a programmable bridge between multiple peripherals and host processors using its large I/O count and configurable logic.
• Signal Processing Supports small-scale, low-latency processing tasks and buffering using on-chip RAM and available logic resources.

Unique Advantages

• Balanced Logic Density: 24,576 logic elements and 1,000,000 gates provide substantial capacity for mid-range FPGA designs without excess overhead.
• Compact BGA Packaging: 256-LBGA / 256-FPBGA (17×17) package enables high-density board layouts while maintaining a surface-mount form factor.
• Wide Industrial Temperature Range: Rated from −40 °C to 85 °C for deployment in industrial environments where temperature variation is a factor.
• Extensive I/O: 177 I/O pins allow flexible interfacing to sensors, actuators, and communications peripherals in single-device solutions.
• Low-Voltage Operation: 1.14 V to 1.575 V supply compatibility for integration into modern low-voltage systems.
• Regulatory Compliance: RoHS-compliant construction supports regulatory and environmental requirements.

Why Choose AGL1000V2-FGG256I?

The AGL1000V2-FGG256I combines a mid-range logic fabric with a sizeable I/O complement and on-chip memory, packaged in a compact 256-LBGA footprint for industrial applications. Its voltage and temperature specifications make it suitable for embedded designs that require robust operation and flexible integration.

This device is well suited to engineers and designers building industrial control, embedded interface, or signal processing solutions who need a scalable, RoHS-compliant FPGA option with clear, verifiable specifications for logic capacity, memory, I/O, and operating conditions.

Request a quote or submit a purchase inquiry to receive pricing and availability for the AGL1000V2-FGG256I and integrate this IGLOO FPGA into your next industrial or embedded design.