AGL1000V2-FG256

The AGL1000V2-FG256 is an IGLOO field programmable gate array (FPGA) IC from Microchip Technology. It delivers a balanced combination of logic capacity, on-chip memory, and I/O count for programmable logic applications.

This device targets designs that require up to 1,000,000 gates of logic, 24,576 logic elements, approximately 0.147 Mbits of embedded memory, and 177 user I/O signals, all packaged in a 256‑pin LBGA suitable for surface-mount assembly.

Key Features

• Core Logic Capacity 24,576 logic elements providing programmable resources for medium-density logic designs.
• Embedded Memory Approximately 0.147 Mbits of on-chip RAM (147,456 total RAM bits) to support buffers, FIFOs, and small local datasets.
• I/O Resources 177 general-purpose I/O pins to support complex interfacing and multiple peripheral connections.
• Logic Gate Scale Up to 1,000,000 gates of logic capacity for implementing sizable custom logic functions.
• Power Supply Supports a core voltage range of 1.14 V to 1.575 V to accommodate target system power rails.
• Package & Mounting 256‑LBGA package (256‑FPBGA, 17×17) in a surface-mount form factor for compact board designs.
• Operating Range & Grade Commercial temperature grade with an operating range of 0 °C to 70 °C.
• Environmental Compliance RoHS compliant for alignment with common environmental requirements.

Typical Applications

• I/O‑intensive interface bridging — Use the 177 I/O pins to connect numerous peripherals, buses, or signal domains in a compact package.
• Embedded control and logic partitioning — 24,576 logic elements and ~0.147 Mbits of RAM enable local control tasks, state machines, and data buffering.
• Prototyping and system integration — The combination of gate count and memory supports development of medium-complexity programmable logic prototypes.
• Compact, board-level FPGA deployment — The 256‑LBGA surface-mount package fits space-constrained PCBs while providing substantial logic and I/O resources.

Unique Advantages

• High logic capacity: 24,576 logic elements and up to 1,000,000 gates provide headroom for complex custom logic implementations.
• On-chip RAM for local buffering: 147,456 bits of embedded RAM reduce external memory dependency for many control and data-path tasks.
• Large I/O complement: 177 I/O pins simplify integration with multiple peripherals and interfaces without additional I/O expanders.
• Compact BGA footprint: 256‑LBGA (17×17) package offers a dense, surface-mount solution for space-limited designs.
• Commercial-grade operating range: Specified for 0 °C to 70 °C operation to match mainstream consumer and general-purpose electronic applications.
• RoHS compliant: Meets environmental compliance expectations for many production programs.

Why Choose AGL1000V2-FG256?

The AGL1000V2-FG256 positions itself as a practical choice for designers who need a medium-density FPGA with significant I/O and embedded memory in a compact BGA package. Its combination of 24,576 logic elements, approximately 0.147 Mbits of RAM, and 177 I/O pins supports a wide range of programmable logic tasks without requiring larger, more complex devices.

Backed by Microchip Technology and accompanied by published product documentation, this IGLOO FPGA is suitable for development and production deployments that require a balance of logic capacity, on-chip memory, and board-level integration in a RoHS-compliant, commercial-grade device.

Request a quote or submit an inquiry to check pricing and availability for the AGL1000V2-FG256 and to discuss volume needs or lead times.