AGL600V5-FG144

The AGL600V5-FG144 is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology designed for commercial electronic products. It provides programmable logic resources, on-chip RAM, and a moderate number of I/O pins in a compact 144-ball BGA package for surface-mount assembly.

Key Features

• Programmable Logic Capacity  Provides 13,824 logic elements (equivalent) and an estimated 600,000 gates to implement custom digital functions and control logic.
• Embedded Memory  Includes 108,000 bits of total RAM (approximately 0.108 Mbits) for on-chip data storage and buffering.
• I/O Resources  Offers 97 user I/O pins to interface with peripherals, sensors, and external devices.
• Power  Requires a 1.425 V supply, enabling a clearly defined power domain for core logic.
• Package & Mounting  Supplied in a 144-FPBGA (13×13) package format and intended for surface-mount assembly; packaged in tray for production handling.
• Operating Range  Commercial-grade temperature rating from 0 °C to 70 °C suitable for standard commercial environments.

Typical Applications

• Commercial embedded systems  Use the FPGA’s 13,824 logic elements and 97 I/Os to implement custom control, glue logic, or protocol handling within commercial products.
• Interface and peripheral bridging  On-chip logic and I/O count make the device suitable for creating custom interfaces between sensors, memory, and host controllers.
• Prototyping and development  Offers a compact, tray-supplied BGA package and defined power/temperature parameters for hardware development and evaluation in commercial designs.

Unique Advantages

• High logic integration: 13,824 logic elements and roughly 600,000 gates allow substantial logic consolidation to reduce external components and simplify PCB layouts.
• On-chip RAM for buffering: 108,000 bits of RAM provide local storage for state, buffering, and small data structures without immediate external memory.
• Clear power requirement: A single 1.425 V supply requirement simplifies power-rail planning for the core domain.
• Compact BGA footprint: 144-FPBGA (13×13) enables dense, space-efficient designs suitable for modern compact PCBs.
• Production-ready packaging: Tray packaging supports automated handling and volume assembly workflows.
• Commercial temperature rating: Specified 0 °C to 70 °C supports mainstream commercial product deployments.

Why Choose AGL600V5-FG144?

The AGL600V5-FG144 delivers a balance of programmable logic capacity, on-chip RAM, and a practical I/O count in a compact BGA package tailored for commercial embedded designs. Its defined 1.425 V supply and 0 °C–70 °C rating make it straightforward to integrate into commercial products where predictable power and thermal parameters are important.

This device is suited to designers who need to consolidate logic, implement custom interfaces, or prototype control functions while maintaining a compact board footprint and production-friendly packaging.

Request a quote or submit an inquiry to get pricing and availability for the AGL600V5-FG144. Our team can provide lead-time details and production-packaging options to support your project planning.