AGL600V5-FG256I

The AGL600V5-FG256I is an IGLOO Field Programmable Gate Array (FPGA) IC from Microchip Technology in a 256-LBGA package. It provides 13,824 logic elements and 110,592 bits of on-chip RAM, along with 177 I/O pins and an estimated 600,000 gates to implement custom digital logic.

Packaged for surface-mount assembly and rated for industrial operation, this device targets designs requiring mid-density programmable logic with defined supply and temperature ranges for reliable deployment in industrial environments.

Key Features

• Core Logic 13,824 logic elements enabling implementation of mid-density custom logic and state machines.
• On-Chip Memory 110,592 bits of embedded RAM (≈0.1106 Mbits) to support buffering, lookup tables, and small data stores.
• Gate Count Approximately 600,000 gates for estimating overall design capacity and complexity.
• I/O Capacity 177 user I/O pins to support multiple interfaces, parallel buses, and mixed signal routing requirements.
• Power Supply Operating voltage range of 1.425 V to 1.575 V to match target system rails and power domains.
• Package and Mounting 256-LBGA (supplier package: 256-FPBGA, 17 × 17) in a surface-mount form factor for compact board integration.
• Industrial Temperature Range Rated for −40 °C to 85 °C operation, suitable for industrial-temperature applications.
• Regulatory Compliance RoHS compliant in alignment with standard environmental requirements.

Typical Applications

• Industrial Control Implement control logic and interface aggregation using the device’s 177 I/Os and industrial temperature rating for reliable operation on factory floors.
• Embedded Systems Mid-density programmable logic and on-chip RAM make this FPGA suitable for custom embedded processing, protocol bridging, and glue-logic tasks.
• I/O-Intensive Designs High I/O count supports designs that require multiple parallel interfaces, sensor interfacing, or external memory/controller connectivity.

Unique Advantages

• Significant Logic Capacity: 13,824 logic elements and ~600,000 gates provide headroom for sizeable custom logic implementations without external ASICs.
• Embedded Memory On-Board: 110,592 bits of RAM reduce dependence on external memory for buffering and small data structures, simplifying PCB design.
• High I/O Count: 177 I/Os enable flexible interface routing and support for multiple simultaneous peripherals or buses.
• Industrial-Rated Operation: −40 °C to 85 °C temperature rating and surface-mount 256-LBGA packaging make the device suitable for robust industrial deployments.
• Compact Package: 256-FPBGA (17 × 17) package delivers a balance of I/O and density for space-constrained boards.
• Manufacturer Backing: Supplied by Microchip Technology, providing a known source for procurement and lifecycle considerations.

Why Choose AGL600V5-FG256I?

The AGL600V5-FG256I positions itself as a mid-density IGLOO FPGA option for designers who need substantial logic resources, embedded RAM, and a high I/O count in an industrial-rated, compact BGA package. Its defined supply range and temperature rating make it suited to industrial embedded projects where predictable electrical and thermal behavior is required.

Engineers and procurement teams targeting industrial control, embedded processing, or I/O-heavy applications will find the combination of logic capacity, on-chip memory, and 177 I/Os a practical choice for reducing system complexity while keeping board area compact. The Microchip Technology supply source supports product availability and lifecycle planning.

Request a quote or submit a pricing inquiry to evaluate AGL600V5-FG256I for your next design project.