AGL600V5-FGG256I
| Part Description |
IGLOO Field Programmable Gate Array (FPGA) IC 177 110592 13824 256-LBGA |
|---|---|
| Quantity | 141 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 8 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FPBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 177 | Voltage | 1.425 V - 1.575 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 13824 | Number of Logic Elements/Cells | 13824 | ||
| Number of Gates | 600000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 110592 |
Overview of AGL600V5-FGG256I – IGLOO FPGA, 256-LBGA, Industrial
The AGL600V5-FGG256I is a Microchip Technology IGLOO flash-based Field Programmable Gate Array (FPGA) in a 256-LBGA package. Built on the IGLOO low-power flash FPGA architecture, it combines nonvolatile flash configuration with Flash*Freeze ultra-low-power modes and support for in-system programming.
With 13,824 logic elements, 110,592 bits of on-chip RAM, and 177 user I/Os in a compact 256-FPBGA (17×17) package, this industrial-grade device targets low-power, instant-on system designs that require moderate logic capacity, embedded memory, and multi-voltage I/O flexibility.
Key Features
- Logic Capacity 13,824 logic elements and approximately 600,000 system gates provide mid-range programmable logic for glue logic, control functions, and custom peripherals.
- Embedded Memory Approximately 0.11 Mbits (110,592 bits) of true dual-port SRAM available for buffers, FIFOs, and small on-chip data stores.
- Low-Power Operation Flash*Freeze technology enables ultra-low-power retention (as low as 5 μW) and Low Power Active operation (from 12 μW), simplifying system power management and enabling instant-on behavior.
- In-System Programming and Security IGLOO family support for in-system programming (ISP) via on-chip 128-bit AES decryption (JTAG/IEEE 1532–compliant) and FlashLock® for protecting FPGA contents.
- I/O and Voltage Support 177 user I/Os with mixed-voltage support and bank-selectable I/O voltages; device supports a wide range of I/O standards and hot-swappable/cold-sparing I/O behavior as provided in the IGLOO family.
- Clocking and Performance Integrated clock conditioning circuitry with configurable CCC blocks and a PLL for clock multiply/divide and phase adjustments; IGLOO family performance up to 250 MHz in 1.5V systems (family-level specification).
- Package and Temperature Surface-mount 256-LBGA package (supplier device package: 256-FPBGA, 17×17) and industrial operating range from −40 °C to 85 °C.
- Power Supply Core voltage support in the specified part ranges from 1.425 V to 1.575 V to meet system requirements in low-voltage designs.
- Compliance RoHS compliant.
Typical Applications
- Embedded Control and Power Management Use the IGLOO device’s Low Power Active and Flash*Freeze modes to implement system power sequencing, wake-up logic, and control functions with minimal standby draw.
- Instant-On Systems Flash-based, nonvolatile configuration enables instant-on behavior and reliable boot-time operation in devices that must resume functionality without reconfiguration delays.
- High-Density Glue Logic Mid-range logic and embedded SRAM are suitable for consolidating glue logic, peripheral interfaces, and protocol bridging in space-constrained designs.
Unique Advantages
- Nonvolatile, Instant-On Configuration: Flash-based configuration retains the programmed design when powered off, eliminating external configuration memory and enabling rapid start-up.
- Ultra-Low Power Retention: Flash*Freeze mode reduces standby power into the microwatt range while retaining SRAM and register contents, helping extend battery life in portable systems.
- Compact, Industrial-Grade Package: A 256-FPBGA (17×17) surface-mount package and −40 °C to 85 °C rating make the device suitable for industrial applications with limited board space.
- Integrated Security and ISP: On-chip AES decryption for in-system programming and FlashLock protection enable secure field updates and intellectual property protection (family-level capability).
- Flexible I/O and Clocking: Bank-selectable I/O voltages, mixed-voltage operation, and configurable clock conditioning blocks with PLL support simplify interfacing and timing design.
Why Choose AGL600V5-FGG256I?
The AGL600V5-FGG256I delivers a balanced combination of nonvolatile flash configuration, low-power operation, and mid-range logic and memory resources in an industrial-grade 256-LBGA package. It is well suited for designers who need instant-on behavior, secure in-system programming, and flexible I/O in compact embedded systems.
Choosing this IGLOO device provides a stable, reprogrammable platform for control, interface, and power-management tasks where low standby consumption and reliable retention of FPGA contents across power cycles are priorities.
Request a quote or submit a purchase inquiry to learn about availability and lead times for the AGL600V5-FGG256I.

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