AGLE3000V2-FG484I

The AGLE3000V2-FG484I is an IGLOOe Field Programmable Gate Array (FPGA) IC from Microchip Technology supplied in a 484-ball BGA package. It provides a balance of on-chip logic, embedded memory and I/O capacity aimed at industrial embedded applications.

With 75,264 logic elements, approximately 0.52 Mbits of embedded memory and 341 user I/Os, this device targets designs that require substantial programmable logic and I/O density within a surface-mount 484-FPBGA (23x23) package and an industrial temperature range.

Key Features

• Core Logic  75,264 logic elements (cells) delivering substantial programmable logic capacity for complex finite state machines, glue logic and custom datapaths.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for buffering, FIFOs and small data stores directly inside the FPGA fabric.
• I/O Density  341 user I/Os to support multiple parallel interfaces, external peripherals and board-level signal routing.
• System Complexity  Approximately 3,000,000 equivalent gates enabling mid-range integration of logic functions and combinational/sequential resources on-chip.
• Power and Supply  Operates from a core supply range of 1.14 V to 1.575 V to match common FPGA power architectures.
• Package and Assembly  Surface-mount 484-FPBGA (23x23) package for compact, board-level integration and high pin density.
• Temperature and Grade  Industrial-grade device rated for an operating temperature range of −40 °C to 85 °C suitable for industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• Industrial Control  Used for programmable control logic, I/O aggregation and protocol bridging where industrial temperature range and high I/O count are required.
• Embedded Processing Peripherals  Integration of custom interfaces, glue logic and small embedded memory blocks to support microcontroller and DSP front-ends.
• Communications and Networking  Implement medium-complexity packet processing, parallel interface handling and timing-critical logic leveraging the device's logic and I/O resources.
• Instrumentation and Test  On-board signal conditioning control, data capture and pre-processing using the FPGA’s logic elements and embedded RAM for buffering.

Unique Advantages

• High logic capacity: 75,264 logic elements enable significant on-chip logic integration, reducing the need for external glue logic.
• Substantial I/O count: 341 user I/Os provide flexibility for multiple parallel interfaces and peripheral connections on a single device.
• On-chip memory: Approximately 0.52 Mbits of embedded RAM supports buffering and small data storage without external memory.
• Compact, board-friendly package: 484-FPBGA (23x23) surface-mount package offers high pin density for compact system designs.
• Industrial temperature rating: −40 °C to 85 °C operation and industrial grade classification for deployment in harsher environments.
• RoHS compliant: Meets lead-free and restricted substances requirements for modern manufacturing workflows.

Why Choose AGLE3000V2-FG484I?

The AGLE3000V2-FG484I positions itself as a versatile mid-range IGLOOe FPGA that combines a large number of logic elements, meaningful on-chip RAM and high I/O density in a compact 484-BGA package. Its core supply range and industrial operating temperature make it suitable for embedded designs that require reliable digital integration across varied environments.

This device is well suited to engineering teams seeking to consolidate board-level logic, implement custom interfaces and retain flexibility for iterative hardware development while maintaining compliance with RoHS requirements.

Request a quote or submit an inquiry to receive pricing, availability and ordering information for the AGLE3000V2-FG484I.