AGLE3000V2-FGG484

The AGLE3000V2-FGG484 is an IGLOOe field programmable gate array from Microchip Technology, offering a programmable logic fabric with 75,264 logic elements and approximately 3,000,000 gates. It integrates on-chip RAM and a high I/O count in a compact 484-ball BGA package for commercial-grade embedded designs.

This device operates from a 1.14 V to 1.575 V supply and across a 0 °C to 70 °C temperature range, is RoHS compliant, and is supplied in a surface-mount 484-FPBGA (23×23) package with 341 I/O pins.

Key Features

• Core Capacity 75,264 logic elements and approximately 3,000,000 gates provide substantial programmable logic density for complex functions.
• Embedded Memory 516,096 bits of on-chip RAM (approximately 0.52 Mbits) for local buffering and state storage.
• I/O Resources 341 user I/O pins enable broad interfacing options to peripherals and external devices.
• Power Wide supply voltage range from 1.14 V to 1.575 V to match target system rails.
• Package & Mounting 484-ball BGA (supplier package: 484-FPBGA, 23×23) optimized for surface-mount PCB assembly.
• Operating Range & Grade Commercial grade device rated for operation from 0 °C to 70 °C.
• Environmental Compliance RoHS compliant.

Unique Advantages

• Substantial programmable capacity: 75,264 logic elements and ~3,000,000 gates enable consolidation of multiple logic functions in a single device.
• On-chip memory: 516,096 bits of embedded RAM reduce dependence on external memory for local data storage and buffering.
• Extensive I/O: 341 I/O pins provide flexibility for diverse interfacing requirements without immediate need for external expanders.
• Compact, surface-mount package: 484-FPBGA (23×23) delivers a dense footprint suited to space-constrained PCB layouts.
• Design-level compliance: RoHS compliance supports regulatory and environmental requirements.

Why Choose AGLE3000V2-FGG484?

The AGLE3000V2-FGG484 positions itself as a high-density IGLOOe FPGA option for commercial embedded applications that require large programmable logic capacity, embedded RAM, and a substantial I/O count in a compact surface-mount BGA package. Its documented voltage supply range and operating temperature make it suitable for standard commercial environments.

For design teams and procurement looking to consolidate logic, manage on-chip buffering, and leverage a dense BGA footprint, this device delivers a balanced combination of capacity, integration, and compliance that aligns with many commercial embedded system requirements.

Request a quote or submit a parts inquiry to receive pricing and availability information for the AGLE3000V2-FGG484.