AGLE3000V2-FGG484I

The AGLE3000V2-FGG484I is an IGLOOe field programmable gate array (FPGA) from Microchip Technology, delivered in a 484-ball BGA package. It provides a balanced combination of logic density, on-chip memory, and I/O capacity suitable for a range of programmable-logic applications.

Key hardware characteristics include 75,264 logic elements, approximately 0.52 Mbits of embedded memory, 341 I/O pins, and a 1.14 V to 1.575 V supply range. The device is specified for industrial temperature operation from −40 °C to 85 °C and is RoHS compliant.

Key Features

• Core Logic  75,264 logic elements (cells) supporting complex programmable logic integration across designs.
• Embedded Memory  Approximately 0.52 Mbits of on-chip RAM for buffering, state storage, and real-time data handling.
• I/O Capacity  341 available I/O pins to support dense peripheral connections, parallel interfaces, and signal routing.
• Gate Count  Approximately 3,000,000 gates to represent the device’s aggregate logic complexity and synthesis target.
• Power and Voltage  Core supply range of 1.14 V to 1.575 V to match low-voltage system domains.
• Package and Mounting  484-BGA package (supplier device package: 484-FPBGA, 23×23) designed for surface-mount assembly.
• Industrial Temperature Range  Rated for operation from −40 °C to 85 °C for deployment in temperature-varying environments.
• Regulatory  RoHS compliant, supporting lead-free assembly and regulatory requirements.

Typical Applications

• Custom digital logic and prototyping  Use the FPGA to implement bespoke logic functions, system glue logic, and rapid hardware iterations.
• Industrial control and automation  Industrial temperature rating and extensive I/O make it suitable for control systems, motor interfaces, and sensor aggregation.
• High-density I/O routing  Leverage 341 I/O pins for bridging multiple peripherals, parallel data buses, or multi-channel interfaces.
• On-chip buffering and data handling  Approximately 0.52 Mbits of embedded RAM supports buffering, FIFOs, and temporary data storage in streaming or packet-based designs.

Unique Advantages

• Substantial logic capacity: 75,264 logic elements enable implementation of large, integrated digital functions without immediate need for external logic.
• Meaningful on-chip memory: Approximately 0.52 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage tasks.
• Extensive I/O count: 341 I/O pins provide flexibility for complex board-level connectivity and parallel interface requirements.
• Industrial-rated operation: Specified operation from −40 °C to 85 °C supports deployment in temperature-challenging environments.
• Compact BGA footprint: 484-FPBGA (23×23) package offers a high-density implementation for space-constrained PCBs with surface-mount assembly.
• RoHS compliance: Conforms to lead-free manufacturing requirements for regulatory and environmental considerations.

Why Choose AGLE3000V2-FGG484I?

The AGLE3000V2-FGG484I positions itself as a versatile IGLOOe FPGA option for designs that require a substantial number of logic elements, embedded RAM, and a high I/O count while maintaining industrial temperature capability. Its combination of 75,264 logic elements, approximately 0.52 Mbits of on-chip memory, and 341 I/O pins makes it suitable for complex digital logic, control systems, and applications requiring significant interfacing density.

Manufactured by Microchip Technology and delivered in a compact 484-BGA surface-mount package, this device is aimed at engineers and teams building robust, scalable embedded systems where integration density, I/O flexibility, and industrial temperature operation are priorities.

Request a quote or submit an inquiry to obtain pricing and availability for the AGLE3000V2-FGG484I. Our team can provide lead-time information and support for volume purchasing.