AGLE3000V5-FGG484I

The AGLE3000V5-FGG484I is an IGLOOe Field Programmable Gate Array (FPGA) IC from Microchip Technology, offering 75,264 logic elements, approximately 0.52 Mbits of embedded memory (516,096 bits), and support for 341 I/O signals in a 484-ball BGA package. The device integrates roughly 3,000,000 gates to implement complex, reconfigurable digital logic.

Configured for surface-mount assembly and rated for industrial operation, this FPGA runs from a core supply of 1.425 V to 1.575 V and is specified for an operating temperature range of −40 °C to 85 °C. RoHS compliant, it is suited to designs that require significant logic capacity, moderate on-chip memory, and high I/O density in a compact package.

Key Features

• Core Logic  Supports 75,264 logic elements (cells) and approximately 3,000,000 gates for implementing large, reconfigurable digital functions.
• Embedded Memory  Contains 516,096 bits of on-chip RAM (approximately 0.52 Mbits) for buffers, state storage, and small data structures.
• I/O and Connectivity  Provides 341 user I/O pins to accommodate high-pin-count interfaces and parallel signal requirements.
• Power  Core supply range specified at 1.425 V to 1.575 V for predictable power budgeting and system integration.
• Package & Mounting  484-BGA footprint (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount configuration for compact board layouts.
• Temperature & Grade  Industrial-grade device rated for −40 °C to 85 °C operation, supporting deployment in temperature-challenging environments.
• Regulatory  RoHS compliant to support environmentally conscious designs.

Typical Applications

• Industrial Control  Use the device’s industrial temperature range, high logic density, and large I/O count to implement control logic and extensive I/O interfacing in factory and process automation equipment.
• Embedded Systems  Implement custom, reconfigurable processing and glue-logic functions using the sizable logic array and on-chip RAM for compact embedded designs.
• High-Density I/O Systems  Leverage 341 I/Os and a dense BGA package for applications requiring many signal connections in a constrained PCB area.

Unique Advantages

• High Logic Capacity: 75,264 logic elements and ~3,000,000 gates enable implementation of complex digital designs without external ASICs.
• On-Chip Memory: Approximately 0.52 Mbits of embedded RAM reduces dependence on external memory for control and buffering tasks.
• Extensive I/O: 341 user I/Os provide flexibility for parallel interfaces and mixed-signal system interconnects.
• Industrial Qualification: Rated for −40 °C to 85 °C operation and listed as industrial grade for deployment in temperature-challenging environments.
• Compact, Surface-Mount BGA: 484-ball FPBGA (23 × 23 mm) package delivers a high-density solution for space-constrained PCBs.
• RoHS Compliant: Environmentally compliant manufacturing and materials support regulatory preferences.

Why Choose AGLE3000V5-FGG484I?

The AGLE3000V5-FGG484I combines substantial logic density, measurable on-chip memory, and a high I/O count in a compact 484-BGA surface-mount package, making it a strong choice for industrial and embedded designs that require reconfigurable digital functionality. Its specified core voltage range and industrial temperature rating help ensure predictable integration into power- and temperature-sensitive systems.

Manufactured by Microchip Technology and RoHS compliant, this FPGA is positioned for engineers seeking a scalable, high-density programmable device that balances logic capacity, I/O flexibility, and rugged operating conditions.

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