AGLE600V2-FGG256I

The AGLE600V2-FGG256I is an IGLOOe field programmable gate array (FPGA) IC from Microchip Technology targeted at industrial and embedded designs. It delivers 13,824 logic elements, approximately 0.11 Mbits of embedded memory, and 165 user I/O pins in a compact 256-LBGA package for applications requiring moderate logic capacity, flexible I/O, and low-voltage operation.

Key Features

• Core Architecture  IGLOOe FPGA device optimized for configurable digital logic integration in embedded and industrial systems.
• Logic Capacity  13,824 logic elements providing a balance of combinational and sequential resources for medium-complexity designs.
• Embedded Memory  Approximately 0.11 Mbits of on-chip RAM to support buffering, small lookup tables, and state storage.
• I/O Resources  165 general-purpose I/O pins to interface with peripherals, sensors, and external devices.
• Gate Equivalent  600,000 gates offering a clear metric for comparative design planning and partitioning.
• Power  Low-voltage core supply range from 1.14 V to 1.575 V suitable for low-power system rails and modern power-domains.
• Package & Mounting  256-LBGA (supplier package 256-FPBGA, 17×17) in a surface-mount form factor for compact board layouts.
• Operating Range  Industrial temperature grade with an operating range of −40 °C to 85 °C for deployment in demanding ambient conditions.
• Environmental Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Industrial Control  Implement motor control logic, I/O aggregation, and real-time interfacing within industrial automation equipment operating across wide temperatures.
• Embedded Processing  Offload deterministic hardware functions and custom state machines in embedded systems that benefit from low-voltage operation and compact packaging.
• Sensor and Data Acquisition  Aggregate and preprocess sensor signals, manage digital filtering, and buffer data using on-chip RAM and plentiful I/O.
• Communications Endpoints  Provide protocol glue logic, parallel-to-serial interfaces, and I/O conditioning in constrained board area with industrial-grade reliability.

Unique Advantages

• Balanced Logic-to-I/O Ratio: 13,824 logic elements paired with 165 I/Os enables designs that require both substantial internal logic and extensive external interfacing.
• Compact, High-Density Package: 256-LBGA (256-FPBGA, 17×17) allows high functionality in a small footprint, simplifying board layout for space-constrained applications.
• Low-Voltage Core Operation: 1.14 V to 1.575 V supply range supports integration into modern low-power systems and power-domain architectures.
• Industrial Temperature Capability: −40 °C to 85 °C rating supports deployment in environments with wide ambient temperature swings.
• Regulatory Simplicity: RoHS compliance helps streamline environmental conformity for production and distribution.
• Clear Design Metrics: Published gate count (600,000) and logic element count make capacity planning and resource allocation straightforward.

Why Choose AGLE600V2-FGG256I?

The AGLE600V2-FGG256I combines mid-range logic density, embedded memory, and a substantial I/O complement in a compact industrial-grade package. Its low-voltage core and RoHS compliance make it suitable for embedded and industrial applications that require reliable, space-efficient programmable logic.

This device is appropriate for engineers designing control, interfacing, and data-acquisition functions where predictable logic capacity, I/O flexibility, and temperature capability are primary selection criteria.

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