AGLE600V2-FGG256

The AGLE600V2-FGG256 is an IGLOOe Field Programmable Gate Array (FPGA) IC from Microchip Technology. It integrates a substantial logic fabric and on-chip memory in a compact 256-LBGA package suitable for surface-mount assembly.

Designed as a commercial-grade device, the AGLE600V2-FGG256 operates from 1.14 V to 1.575 V and across a 0 °C to 70 °C temperature range, making it appropriate for a wide range of standard embedded and system-integration projects.

Key Features

• Logic Capacity  Provides 13,824 logic elements (often referenced as LABs/CLBs), equivalent to approximately 600,000 gates for implementing custom digital logic and state machines.
• Embedded Memory  Includes 110,592 bits of on-chip RAM—approximately 0.11 Mbits—available for buffers, FIFOs, and small data stores.
• I/O Count  Offers 165 general-purpose I/O pins to support multiple interfaces and parallel connections to peripherals.
• Power Supply Range  Operates from 1.14 V to 1.575 V, enabling integration into low-voltage digital power domains.
• Package & Mounting  Supplied in a 256-LBGA package (vendor package: 256-FPBGA, 17 × 17 mm) and intended for surface-mount assembly.
• Operating Conditions  Commercial-grade operation from 0 °C to 70 °C to match typical consumer and commercial product requirements.
• Regulatory Compliance  RoHS compliant, supporting environmental and manufacturing restrictions on hazardous substances.

Typical Applications

• Peripheral Bridging  Use the device’s 165 I/O to implement custom bus adapters, parallel interface bridges, and protocol conversion logic.
• Glue Logic and Control  Leverage 13,824 logic elements to implement board-level glue logic, control sequencing, and custom state machines for embedded systems.
• Memory Buffering and Small Data Stores  Employ the approximately 0.11 Mbits of embedded RAM for buffering, FIFO implementations, and temporary data storage.

Unique Advantages

• Substantial Logic in a Compact Package: 13,824 logic elements and roughly 600,000 gates deliver meaningful logic density in a 256-LBGA footprint to save board area.
• Flexible I/O Count: 165 I/O pins provide flexibility to connect multiple peripherals and interfaces without immediate external logic expansion.
• Low-Voltage Operation: The 1.14 V to 1.575 V supply window supports integration into modern low-voltage digital systems.
• On-Chip RAM Resource: Approximately 0.11 Mbits of embedded RAM reduces dependence on external memory for small buffering and control tasks.
• RoHS Compliant: Meets RoHS requirements to simplify regulatory compliance for commercial products.

Why Choose AGLE600V2-FGG256?

The AGLE600V2-FGG256 positions itself as a capable commercial-grade FPGA for designers who need moderate-to-high logic capacity and a generous I/O count in a surface-mount 256-LBGA package. Its combination of 13,824 logic elements, approximately 0.11 Mbits of on-chip RAM, and 165 I/Os makes it suitable for projects that require board-level integration of custom digital functions without extensive external components.

Manufactured by Microchip Technology and offered with RoHS compliance, this device is appropriate for standard commercial embedded applications that operate within the 0 °C to 70 °C range and 1.14 V–1.575 V power domains.

Request a quote or submit an inquiry to obtain pricing and availability for AGLE600V2-FGG256. Our team can assist with lead times and ordering information.