AGLE600V2-FG256I

The AGLE600V2-FG256I is an IGLOOe Field Programmable Gate Array (FPGA) from Microchip Technology that provides a balanced combination of logic capacity, embedded memory, and I/O density in a compact BGA package. Designed for industrial-grade applications, it offers a defined operating range and supply window suitable for embedded and control-oriented designs.

With 13,824 logic elements, approximately 0.11 Mbits of embedded RAM, and 165 user I/O pins, this device targets applications that require mid-range programmable logic, moderate on-chip memory, and a compact board-level footprint.

Key Features

• Core Logic  13,824 logic elements (cells) supporting up to 600,000 equivalent gates for implementing custom digital functions and control logic.
• Embedded Memory  Approximately 0.11 Mbits (110,592 bits) of on-chip RAM for buffering, state storage, and small data tables.
• I/O Density  165 user I/O pins to support peripheral interfaces, sensor connections, and board-level signal routing.
• Power and Voltage Range  Operates from a supply voltage range of 1.14 V to 1.575 V to match system power rails and low-voltage designs.
• Package & Mounting  256-ball LFBGA (supplier package 256-FPBGA, 17×17) in a surface-mount form factor for compact PCB integration.
• Industrial Temperature Grade  Specified for operation from −40 °C to 85 °C, suitable for industrial environments and temperature-demanding applications.
• Compliance  RoHS compliant for environmental and regulatory compatibility in modern assemblies.

Typical Applications

• Industrial control  Programmable logic and 165 I/Os enable custom control, interlocking, and signal aggregation in industrial automation equipment operating within −40 °C to 85 °C.
• Embedded processing  13,824 logic elements and on-chip RAM support glue logic, protocol handling, and custom data-path implementations in embedded systems.
• Compact board designs  The 256-LBGA (17×17) package and surface-mount mounting make this FPGA suitable for space-constrained PCBs where high integration is required.
• Interface bridging  165 I/O pins provide flexibility for implementing protocol bridges, signal conditioning, and peripheral interfaces on a single device.

Unique Advantages

• Well-balanced logic capacity: 13,824 logic elements and 600,000 gates provide sufficient density for moderate to complex logic functions without oversizing the bill of materials.
• On-chip RAM for local buffering: 110,592 bits of embedded memory reduce external memory dependencies for small data storage and state machines.
• High I/O count: 165 user I/Os simplify system integration by accommodating multiple peripherals and signal domains directly on the FPGA.
• Industrial-grade temperature range: Specified operation from −40 °C to 85 °C supports deployment in temperature-challenging environments.
• Compact BGA package: 256-LBGA (256-FPBGA, 17×17) offers a small PCB footprint for dense board layouts and surface-mount assembly.
• Regulatory readiness: RoHS compliance aids in meeting environmental requirements for commercial and industrial products.

Why Choose AGLE600V2-FG256I?

The AGLE600V2-FG256I positions itself as a practical, industrial-grade FPGA option for designers who need a mid-range logic fabric with substantial I/O and embedded memory in a compact package. Backed by Microchip Technology, it delivers measurable integration—logic elements, on-chip RAM, and 165 I/Os—within a defined supply voltage and temperature window for reliable system operation.

This device is well suited to teams building industrial controls, embedded interfaces, and compact systems that require deterministic operating limits, a compact 256-LBGA footprint, and RoHS compliance. Its combination of logic density and I/O makes it a viable choice for designs that benefit from on-board programmability while minimizing external components.

Request a quote or submit an inquiry to receive pricing, availability, and lead-time information for the AGLE600V2-FG256I. Our team can assist with configuration and procurement details.